Apparatus for forming complex nanoparticle film and method for forming nanoparticle film using same

Abstract

An apparatus (1) for forming a complex nanoparticle film is provided with: a generation chamber (2) in which a plurality of metal materials (4a-4c) are disposed, complex nanoparticles (9) being generated from nanoparticles (8a-8c); a film-formation chamber (3) in which a substrate (7) is arranged; and particle-formation units (11a-11c) arranged in the generation chamber (2) correspondingly with respect to each of the plurality of metal materials (4a-4c), the particle-formation units (11a-11c) having containers (12a-12c) for covering the metal materials (4a-4c), heaters (15a-15c) arranged in the containers (12a-12c), outflow openings (13a-13c) provided in the containers (12a-12c) from which the nanoparticles (8a-8c) flow out, and introduction openings (14a-14c) provided in the containers (12a-12c) through which cooling gas is introduced.

Description

technical field [0001] The present invention relates to a multi-component nanoparticle film forming device and a nanoparticle film forming method using the same. Background technique [0002] Patent Document 1 describes an ultrafine particle film forming method and an ultrafine particle film forming apparatus. The device generates vapor atoms from materials, and moves them together with inert gas in the transfer tube to form an ultrafine particle film on the substrate. In a general expression of such a particle film forming apparatus and method, in other words, chambers are arranged up and down and communicated with each other through thin tubes. Also, the upper chamber is evacuated to allow the cooling gas to flow to the lower chamber. The evaporated metal is cooled and moves towards the upper chamber due to the pressure difference. Furthermore, it is captured in the state of particles on the substrate in the upper chamber. The cooling gas is, for example, helium or arg...

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Problems solved by technology

In addition, since the thermal influence of metal materials spreads to other metal materials, metal materials with low melting points cannot be placed next to metal materials with high melting points, and there are also restrictions on the installation position of metal materials.

As mentioned above, in order to obtain the desired multi-component metal nanoparticles, it is difficult to control the temperature, and it is also difficult to adjust the particle diameter and particle amount.

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