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Apparatus and method for measuring resistivity of wafers

A resistivity and wafer technology, which is applied in the field of devices for measuring wafer resistivity, can solve problems such as inaccurate measurement results and achieve accurate measurement results

Active Publication Date: 2014-12-31
SEMICON TECH INNOVATION CENT(BEIJING) CORP
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] However, in actual operation, due to the need to measure the resistivity of different films, the thickness and material of different films are different, and some films are thin and loose. broken, the resulting measurement data is 0, that is, the measurement result is inaccurate

Method used

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  • Apparatus and method for measuring resistivity of wafers

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Embodiment Construction

[0024] The device and method for measuring wafer resistivity proposed by the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0025] Please refer to figure 1 , the present invention proposes a device for measuring wafer resistivity, including: a measuring head disk 100, a measuring head, a displacement rod 300, a rotating motor 400, and a signal line 500;

[0026] In this embodiment, the measuring heads are arranged on one side of the measuring head disk 100, and the measuring heads are divided into a first group of measuring heads and a second group of measuring heads, w...

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Abstract

The invention provides an apparatus and method for measuring the resistivity of wafers. The apparatus for measuring the resistivity of the wafers comprises a measuring head disc, measuring heads, displacement rods and a rotary motor; the measuring heads are arranged on one surface of the measuring head disc; the measuring heads are divided into a first group of measuring heads and a second group of measuring heads; the radius of curvature of the heads of the second group of measuring heads is larger than that of the heads of the first group of measuring heads; the displacement rods are arranged between the measuring heads and the measured measuring head disc; the rotary motor is arranged at the other surface of the measuring head disc; after the first group of measuring heads is utilized to measure a film on the surface of a wafer to be measured for the first time, initial results are analyzed; if the initial results are abnormal, it is indicated that the first group of measuring heads puncture the film on the surface of the wafer to be measured, and the second group of measuring heads of which the heads having larger radius of curvature is utilized to measure the wafer to be measured for the second time, and the second group of measuring heads has little possibility of puncturing the film on the surface of the wafer to be measured, and therefore, accurate measuring results can be obtained.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a device and method for measuring wafer resistivity. Background technique [0002] In the field of semiconductor manufacturing, the resistivity of the semiconductor wafer is one of the key parameters. Whether the resistivity is within the acceptable range directly affects the overall performance of the semiconductor wafer. Therefore, in actual production, it is necessary to measure the resistivity of the semiconductor wafer. [0003] In the prior art, a measuring head (Probe) is used to perform penetration measurement on the film formed on the surface of the semiconductor wafer, that is, the measuring head is inserted into the film to be measured on the surface of the semiconductor wafer, and through the measurement The head applies a voltage to the thin film on the surface of the semiconductor wafer, and measures the current to obtain the resistivity. [0004] Howeve...

Claims

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Application Information

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IPC IPC(8): G01R27/02
Inventor 李广宁唐强许亮
Owner SEMICON TECH INNOVATION CENT(BEIJING) CORP
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