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Conductor structure with integrated through-hole components

A conductor structure and assembly technology, applied in electrical components, printed circuit components, high-frequency matching devices, etc., can solve problems affecting the ability of channels to transmit signals

Active Publication Date: 2017-07-04
XILINX INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

A channel formed using one or more traces with the aforementioned metrics may suffer from various types of losses that affect the channel's ability to carry signals, especially at high frequencies

Method used

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  • Conductor structure with integrated through-hole components
  • Conductor structure with integrated through-hole components
  • Conductor structure with integrated through-hole components

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Embodiment Construction

[0035] Although the description concludes by defining the features of one or more embodiments that are regarded as novel concepts; however, it is believed that the one or more embodiments will be better understood by discussing the description of the invention in conjunction with the preceding figures. As required, the present invention will disclose one or more detailed embodiments in this specification. It should be understood, however, that the one or more embodiments are exemplary only. Therefore, specific structural and functional details disclosed in this specification are not to be interpreted as limiting; A representative basis for employing the one or more embodiments in various ways is appropriately detailed in the structure. Further, the terms and phrases used herein do not have a limiting meaning; rather, they provide an understandable description of the one or more embodiments disclosed herein.

[0036] One or more embodiments disclosed in this specification rel...

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PUM

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Abstract

An electrical circuit structure (100) may include a first trace (105) formed using a first conductor layer and a second trace (110) formed using a second conductor layer. The first trace may be vertically aligned with the second trace. The electrical circuit structure may comprise a via section (115) formed of conductor material in a third conductor layer between the first conductor layer and the second conductor layer. The via segment may contact the first trace and the second trace to form a first conductor structure configured to transmit electrical signals in a direction parallel to the first conductor layer.

Description

technical field [0001] One or more embodiments disclosed in this specification relate to a conductor structure for use in an electrical circuit. More specifically, one or more embodiments of the invention relate to forming conductive structures using via technology. Background technique [0002] Continuing advances in electrical circuit processing are helping to create smaller and smaller devices with smaller (and finer) design rules. For example, referring to the Integrated Circuit (IC) technology utilizing an organic substrate, a plurality of fine circuit traces can be formed on the order of about 20 μm. Likewise, the spacing specified in the design rules may be on the order of about 20 μm. Correspondingly, the thickness of the dielectric layer of the electrical circuit (whether implemented by using Printed Circuit Board (PCB) technology or IC technology) will become thinner and thinner. Referring again to IC technology, the thickness of the dielectric layer is on the o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02
CPCH05K1/0221H05K1/0242H05K1/0251H05K2201/09672H05K2201/098H05K2201/09854
Inventor 保罗·Y·吴
Owner XILINX INC