A BGA package test socket with pin test function

Abstract

The invention discloses a BGA package test socket with pin test function, which is characterized in that the socket includes a substrate, a programmable logic device embedded in the substrate and a pin test point, the substrate is an integrated PCB board, and the interior of the substrate is equipped with There are traces, and the traces are connected to the pins of the programmable logic device. A slot is provided in the center of the upper surface of the substrate, and a slot point is provided in the slot. The slot is used to insert the BGA chip to be tested. The slot pitch of the slot is consistent with the ball pin pitch of the BGA chip to be tested and the specifications, and the row and column numbers of the socket points are respectively greater than the row number and the column number of the ball pin package of the BGA chip to be tested; The bottom surface of the substrate is provided with substrate pins, and the programmable logic device is connected with the substrate pins and the spherical pins of the BGA chip to be tested; the pin test points are drawn out by the programmable logic device and evenly distributed on the upper surface of the substrate edge.

Description

technical field [0001] The invention relates to a test socket, in particular to a BGA packaging test socket with a pin test function. Background technique [0002] The pin measurement of the BGA package chip needs to be considered before the PCB board design, and it is necessary to lead out a test point for each pin to be measured, and reserve it for the PCB board test. If no test points are drawn out during PCB board design, then if a problem occurs during system testing, it will not be possible to use equipment such as an oscilloscope for measurement. [0003] The pin spacing specifications of BGA package chips are limited, generally 1.27mm, 1mm, 0.8mm, 0.65mm, 0.5mm, 0.45mm, 0.4mm, 0.3mm and other specifications, but under the same specification, the number of pins of BGA chips There is a big difference in distribution and distribution. Many non-standard packaged BGA chips cannot be placed in standard BGA package sockets, and sockets with special formats need to be custo...

AI Technical Summary

Problems solved by technology

If no test points are drawn out during PCB board design, then if there is a problem during system testing, it will not be possible to use equipment such as an oscilloscope for measurement

[0003] The pin spacing specifications of BGA package chips are limited, generally 1.27mm, 1mm, 0.8mm, 0.65mm, 0.5mm, 0.45mm, 0.4mm, 0.3mm and other specifications, but under the same specification, the number of pins of BGA chips There is a big difference in distribution and distribution. Many non-standard packaged BGA chips cannot be placed in standard BGA package sockets, and sockets with special formats need to be customized, which greatly increases the test cost and cycle of small batch chips.

[0004] The traditional board-level test system must reserve test points for specific pins, which cannot be changed once determined; if it is necessary to retain the test capability for all BGA pins, all pins need to be led out of the test points

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