Unlock instant, AI-driven research and patent intelligence for your innovation.

Laminated electronic component

A technology for electronic components and laminates, which is applied in the direction of electrical components, printed electrical components, printed circuit components, etc., can solve problems such as increased DC resistance, and achieve the effect of low DC resistance value

Active Publication Date: 2015-01-14
MURATA MFG CO LTD
View PDF7 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in Patent Document 2, there is a portion where the conductor pattern is one layer (a portion that is not juxtaposed), and there is a problem that the direct current resistance increases significantly at this portion.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Laminated electronic component
  • Laminated electronic component
  • Laminated electronic component

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0040] figure 1 is a perspective view showing the layer structure of the first embodiment of the laminated electronic component 100 according to the present invention.

[0041] figure 2 It is a plan view showing the arrangement of layers of the laminated electronic component 100 of the first embodiment.

[0042] image 3 It is a cross-sectional view showing a state in which each layer of the laminated electronic component 100 of the first embodiment is cut and laminated, and an insulator layer is omitted. Although the image 3 summarized in the figure 2 The cross-section at the position shown by arrow A-A in , however, it does not show the exact cross-section, but shows the structure on the inner side of the paper that is deeper than the cutting position, and the structure is regarded as a partially perspective state. Shows. The structures shown through this perspective include the first connection parts 100L1b, 100L2b, 100L13c, 100L14c, 100L19b, 100L20b and the second...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A laminated electronic component is configured such that insulator layers and conductor patterns are laminated and a coil is formed in a laminate of the insulator layers and the conductor patterns by connecting the conductor patterns among the insulator layers, where the coil includes conductor pattern pairs each composed of two conductor patterns arranged so as to sandwich each insulator layer, and includes a first connecting portion connecting both end portions of the two conductor patterns so as to connect the two connecting patterns in parallel and a second connecting portion connecting a plurality of the conductor pattern pairs in series, where the first connecting portion and the second connecting portion are arranged so as to be displaced from each other in a direction of a line length of a coil pattern.

Description

technical field [0001] The present invention relates to a laminated electronic component in which a circuit is formed inside a laminate in which an insulator layer and a conductor pattern are laminated. Background technique [0002] With the miniaturization and high performance of mobile devices, small multilayer power inductors are currently used as inductors for power supply circuits that function as DCDC converters. In recent years, there has been a trend toward larger currents, so inductor specifications with lower DC resistance characteristics are required. [0003] As a method of reducing the DC resistance, for example, there is a method of increasing the cross-sectional area of ​​the inner conductor and shortening the line length. However, if the width of the conductor is widened, the method of increasing the cross-sectional area leads to a decrease in the area through which the magnetic flux passes and a decrease in the inductance value. In addition, if the thickne...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01F17/00H01F37/00H01F27/28
CPCH05K1/0298H05K1/165H05K2201/09845
Inventor 野口裕山本诚小林武士
Owner MURATA MFG CO LTD