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Mechanisms for Forming Package Structures

A packaging structure and bump technology, applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc.

Active Publication Date: 2018-09-25
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These related new packaging technologies for semiconductor devices face manufacturing challenges

Method used

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  • Mechanisms for Forming Package Structures
  • Mechanisms for Forming Package Structures
  • Mechanisms for Forming Package Structures

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Embodiment Construction

[0036] The making and using of embodiments of the invention are discussed in detail below. It should be understood, however, that embodiments of the invention may be embodied in a wide variety of specific contexts. The specific embodiments discussed are for illustration only, and do not limit the scope of the invention.

[0037] It should be understood that the following disclosure provides many different embodiments or examples for implementing different features of the invention. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are merely examples and are not intended to limit the invention. In addition, in the following description, performing the first process before the second process includes an embodiment in which the second process is performed immediately after the first process, and also includes an embodiment in which an additional process is performed between the first and second processes ...

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PUM

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Abstract

Embodiments of mechanisms for forming a package structure are provided. A method for forming a package structure includes providing a semiconductor die and forming a first bump structure and a second bump structure over the semiconductor die. The second bump structure is thinner and wider than the first bump structure. The method also includes providing a substrate having a first contact pad and a second contact pad formed on the substrate. The method further includes forming a first solder paste structure and a second solder paste structure over the first contact pad and the second contact pad, respectively. The second solder paste structure is thicker than the first solder paste structure. In addition, the method includes reflowing the first bump structure and the second bump structure with the first solder paste structure and the second solder paste structure, respectively, to bond the semiconductor die to the substrate.

Description

technical field [0001] The present invention relates generally to the field of semiconductors and, more particularly, to mechanisms for forming package structures. Background technique [0002] Semiconductor devices are used in various electronic applications such as personal computers, cell phones, digital cameras or other electronic equipment. Semiconductor devices are typically fabricated by sequentially depositing an insulating or dielectric layer, a conductive layer, and a semiconductor layer over a semiconductor substrate, and then patterning the various material layers using photolithography and etching processes to form circuit components and elements on the semiconductor substrate. [0003] The semiconductor industry continues to increase the level of integration of various electronic components (eg, transistors, diodes, resistors, capacitors, etc.) by continually reducing the size of the smallest components, which allows more components to be integrated into a give...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60H01L23/482
CPCH01L24/17H01L23/49811H01L24/05H01L24/11H01L24/13H01L24/14H01L24/16H01L24/81H01L25/0657H01L25/50H01L2224/0401H01L2224/05073H01L2224/05166H01L2224/05181H01L2224/05187H01L2224/05647H01L2224/11005H01L2224/1132H01L2224/11334H01L2224/11849H01L2224/131H01L2224/1403H01L2224/14051H01L2224/14131H01L2224/14134H01L2224/14164H01L2224/14177H01L2224/14179H01L2224/16058H01L2224/16225H01L2224/16227H01L2224/1703H01L2224/17051H01L2224/1713H01L2224/17135H01L2224/81193H01L2224/81815H01L2225/06513H01L2225/06517H01L2924/1305H01L2924/13091H01L2924/351H01L2924/3512H01L2924/381H01L2924/00H01L2924/014H01L2924/04941H01L2924/04953H01L2924/00014H01L2924/01047H01L2924/01024H01L2924/01028H01L2924/01011H01L2924/01079H01L2924/00012
Inventor 陈宪伟
Owner TAIWAN SEMICON MFG CO LTD