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A method of directly forming a conductive pattern on an insulating substrate and its application

A technology of insulating substrates and conductive patterns, which is applied in the direction of electrical components, printed circuits, and printed circuit manufacturing, and can solve problems such as complex processes, high costs, and poor adhesion

Active Publication Date: 2018-05-01
COSONIC INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, there are two commonly used methods, one is to form a complete conductive layer on the insulating substrate by means of electroplating, bonding or sputtering, and then remove the excess part by corrosion, engraving, etching, etc. to form the circuit I need The other is LDS (Laser Direct Structuring) technology, which needs to add LDS laser powder into the plastic material, after laser activation, and then form a conductive pattern by electroless plating, these two methods are very good in terms of technology. It is complex and the cost is very high, especially for LDS materials, and the circuit pattern formed by the LDS process has poor adhesion

Method used

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  • A method of directly forming a conductive pattern on an insulating substrate and its application

Examples

Experimental program
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Effect test

Embodiment 1

[0027] A method for directly forming a conductive pattern on plastic, comprising the following steps:

[0028] 1) Spread or absorb a layer of copper powder on the plastic;

[0029] 2) Place the plastic on which the copper powder is spread in step 1 in a nitrogen atmosphere, and then a laser machine loaded with a designed circuit pattern selectively scans the copper powder, and the scanned copper powder is instantly melted and fused with the plastic. forming a conductive pattern;

[0030] 3) Remove the unscanned copper powder with a brush, and recycle the removed copper powder.

[0031] Wherein, the plastic can be a thermosetting plastic formed in a solid state, and the thermosetting plastic formed in a solid state is selected from syndiotactic polystyrene (SPS), polycarbonate (PC), nylon (PA6, PA66, PA11, PA10, PA610, PA612), Polypropylene (PP) or one or more copolymers of acrylonitrile, butadiene, and propylene (ABS), etc., can be the most common commercially available plas...

Embodiment 2

[0036] A method for directly forming conductive patterns on ceramics, comprising the following steps:

[0037] 1) Spread or absorb a layer of aluminum powder on the ceramic;

[0038] 2) Place the ceramic covered with aluminum powder in step 1 in an argon atmosphere, and then a laser machine loaded with a designed circuit pattern selectively scans the aluminum powder, and the scanned aluminum powder melts instantly and fuses with the ceramic , forming a conductive pattern;

[0039] 3) Remove the unscanned aluminum powder with a brush, and recycle the removed aluminum powder.

[0040] Wherein, the ceramics can be common commercially available ceramics, and ceramic materials with other auxiliary functions can also be used. The selection of ceramics can be based on the occasion of use, and the variety, size and shape can be selected arbitrarily.

[0041] Wherein, the laser machine in step 2 is an ultraviolet laser machine, the wavelength of electromagnetic rays of the laser mach...

Embodiment 3

[0044] A method for directly forming conductive patterns on glass, comprising the following steps:

[0045] 1) Spread or absorb a layer of gold powder on the glass;

[0046] 2) Place the glass on which the gold powder is adsorbed in step 1 in a carbon dioxide atmosphere, and then a laser machine loaded with a designed circuit pattern selectively scans the gold powder, and the scanned gold powder instantly melts and fuses with the glass to form a conductive pattern;

[0047] 3) Shake off the unscanned gold powder with machine vibration, and recycle the cleaned gold powder.

[0048]Among them, the glass can use the most common and common glass, or special glass with auxiliary functions. The selection of glass can be based on the occasion of use, and the variety, size and shape can be selected arbitrarily.

[0049] Specifically, the adsorption described in step 1 adopts electrostatic adsorption, and an electrostatic generator is used to charge the gold powder with static electri...

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Abstract

The invention relates to the technical field of three-dimensional circuits and applications, in particular to a method for directly forming a conductive pattern on an insulating substrate and its application. The method includes the following steps: 1) spreading or absorbing a layer of conductive powder on the insulating substrate; 2) Place the insulating substrate that is tiled or adsorbed with conductive powder in step 1 in a gas atmosphere, and then the laser machine loaded with the designed circuit pattern selectively scans the conductive powder, and the scanned conductive powder is instantly melted, and the The insulating base material is welded together to form a conductive pattern; 3) Remove the conductive powder that has not been scanned, and the insulating base material and the conductive powder are welded together at high temperature to form a conductive pattern, and the adhesion is very good; the base material has a wide range of sources, only need to adjust the laser power, it can adapt to insulating substrates of different materials; the unscanned conductive powder can be recycled, saving resources; the process is simple, suitable for large-scale industrial production, and can be used in earphones, speakers, bracelets, mobile phones, etc., and has a wide range of applications.

Description

technical field [0001] The invention relates to the technical field of three-dimensional circuits and applications, in particular to a method for directly forming a conductive pattern on an insulating base material and its application. Background technique [0002] At present, there are two commonly used methods, one is to form a complete conductive layer on the insulating substrate by means of electroplating, bonding or sputtering, and then remove the excess part by corrosion, engraving, etching, etc. to form the circuit I need The other is LDS (Laser Direct Structuring) technology, which needs to add LDS laser powder into the plastic material, after laser activation, and then form a conductive pattern by electroless plating, these two methods are very good in terms of technology. It is complex and the cost is very high, especially for LDS materials, and the circuit pattern formed by the LDS process has poor adhesion. [0003] Therefore, there is an urgent need to provide ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/02
Inventor 胡平胡中骥
Owner COSONIC INTELLIGENT TECH CO LTD