Heat pipe
Patent Information
- Authority / Receiving Office
- CN ยท China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- INVENTEC PUDONG TECH CORPOARTION
- Publication Date
- 2016-04-20
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Abstract
Description
technical field
[0001] The invention relates to a radiator, in particular to a heat pipe. Background technique
[0002] The calculation speed of modern electronic products continues to increase, and the heat generated by them is also getting higher and higher. Therefore, the heat dissipation device composed of extruded aluminum heat sinks and fans in the past can no longer meet the needs of current calculators. Especially the current trend of electronic products is to make products smaller and smaller, but this also limits the space for heat dissipation. Under the influence of these two important factors, heat dissipation technology is facing a severe test. Therefore, it is an urgent task to develop heat pipes with higher heat conduction efficiency to effectively solve the current heat dissipation problem.
[0003] A known heat pipe includes a shell and a liquid-absorbing wick, wherein the liquid-absorbing wick is disposed on the inner sidewall of the copper tube, and the s...