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Debonding component applied to wafer packaging

A wafer packaging and detachment technology, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as slowing down production efficiency

Active Publication Date: 2015-03-18
SUREGIANT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] Compression molding is currently the most important processing method for thermosetting plastics, but since thermosetting plastics must be cooled to harden, it is necessary to wait for the mold to cool before returning the parts during compression molding, which greatly slows down production efficiency

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  • Debonding component applied to wafer packaging
  • Debonding component applied to wafer packaging
  • Debonding component applied to wafer packaging

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Embodiment Construction

[0037] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, in conjunction with the accompanying drawings and preferred embodiments, the specific implementation and structure of the detachable component applied to the wafer package according to the present invention will be described below. , features and their effects are described in detail below.

[0038] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of preferred embodiments with reference to the drawings. Through the description of specific embodiments, it should be possible to obtain a deeper and more specific understanding of the technical means and effects of the present invention to achieve the intended purpose, but the attached drawings are only for reference and description, and are not used to explain the present invention. ...

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Abstract

The invention relates to a debonding component applied to wafer packaging and the debonding component is applied to the inner surface of an upper mold and a lower mold of a mold of a transfer molding technology and is also a debonding component which is applied to wafer packaging of an IC. The debonding component includes a carrier material and debonding layer which is combined with the carrier material. The carrier material is made of a plastic material and is 0.016-0.5mm in thickness. The plastic material is selected from any one of the following groups: PET, PP, PC, PE, PI or PVC film. A manufacturing material of the debonding layer can be pure silica gel or a silica gel / rubber compound and is 0.02-2mm in thickness. The debonding component is capable of providing a stable debonding force when a molding component of a transfer molding technology is separated with a mold so that the it is easy to separate the molding component from the mold and it is prevented that plastic is leaved on the mold.

Description

technical field [0001] The invention relates to the technology of transfer molding wafer packaging, in particular to a release element applied to transfer molding wafer packaging. Background technique [0002] At present, compression molding is the most important processing method for thermosetting plastics, but since thermosetting plastics must be cooled to harden, it is necessary to wait for the mold to cool before returning the parts during compression molding, which greatly slows down the production efficiency. In view of this, transfer molding technology has been proposed, in which the equipment required for transfer molding mainly includes a mold, a heated transfer chamber, and a power source. see figure 1 Shown is a schematic diagram of the existing conventional transfer molding process, such as figure 1 As shown, transfer molding includes the following process steps: [0003] (1) A molded plastic 11' is placed in a transfer chamber 15'; [0004] (2) A component 6...

Claims

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Application Information

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IPC IPC(8): H01L21/56
CPCH01L21/566
Inventor æšć…æ–Œ
Owner SUREGIANT TECH