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Measuring method of focusing and leveling spot horizontal position

A technology of focusing, leveling, and measuring methods, which is applied in the field of projection lithography, can solve the problem of low measurement accuracy, and achieve the effect of precise spot position and high precision

Active Publication Date: 2017-01-04
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Description
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  • Application Information

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Problems solved by technology

This method is affected by the calibration error between the rotation center of the workpiece table and the physical center of the workpiece table, the calibration error between the physical center of the workpiece table and the optical axis of the objective lens, and the tilt range of the workpiece table, so the measurement accuracy is not high

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  • Measuring method of focusing and leveling spot horizontal position
  • Measuring method of focusing and leveling spot horizontal position
  • Measuring method of focusing and leveling spot horizontal position

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Embodiment Construction

[0033] Due to the mechanical installation error of the focusing and leveling system, there will be a deviation between the focus and leveling spot center and the theoretical position, such as Figure 1a shown. When the workpiece stage is not perpendicular to the optical axis of the objective lens, the offset will cause vertical measurement errors. Figure 1b It is a schematic diagram of the vertical measurement error caused by the horizontal position deviation of the light spot. In the figure, A is the theoretical position of the light spot, and A' is the actual position of the light spot. The formula for calculating the vertical error is as follows

[0034] ΔZ=-θ y ·ΔX+θ x ·ΔY

[0035] Among them, Δz is the vertical error, θ y and θ x is the inclination angle of the workpiece table, and ΔX and ΔY are the offsets of the horizontal position of the focusing and leveling spot. The method for measuring the horizontal position of the focusing and leveling light spot of the pre...

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Abstract

The invention discloses a method for measuring a horizontal position of a focusing and leveling light spot. The method is applied to projection mask aligner equipment and adopts a silicon chip tool. The silicon chip tool is provided with an alignment mark, a square mark and a reference area. The measuring method comprises: step 1, calculating a position deviation between the center of the silicon chip tool and an alignment optical axis by using the alignment mark on the silicon chip tool and a silicon chip alignment system; step 2, scanning the square mark and the reference area on the silicon chip tool in four chip feeding directions of the silicon chip tool by the focusing and leveling light spot and obtaining a scanning result; step 3, calculating position deviation between the center of the focusing and leveling light spot and the alignment optical axis by utilizing the position deviation between the center of the silicon chip tool and the alignment optical axis and the scanning result. According to the invention, the silicon chip tool is used as an auxiliary tool and the horizontal position of the focusing and leveling light spot is measured through a silicon chip alignment method. A more accurate light spot position can be obtained with a higher accuracy of silicon chip alignment.

Description

technical field [0001] The invention relates to the field of projection lithography, in particular to a method for measuring the horizontal position of a focusing and leveling spot. Background technique [0002] Projection lithography technology has been widely used in the integrated circuit manufacturing process. This technology exposes through an optical projection device to transfer the designed mask pattern to the photoresist. The Focus & Level Sensor (FLS for short) is one of the important subsystems of the lithography machine, which is responsible for measuring the height and tilt information of the upper surface of the silicon wafer. By combining with the workpiece table system that carries the silicon wafer and the silicon wafer alignment system that measures the positional relationship between the silicon wafer and the workpiece table, the exposed area of ​​the silicon wafer is always within the focal depth of the objective lens system of the lithography machine, so...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20G03F9/00
Inventor 韩春燕
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD