A chip adhesion detection device
A detection device and chip technology, which is applied in semiconductor/solid-state device testing/measurement, electrical components, semiconductor/solid-state device manufacturing, etc., can solve the problems of lower pass rate, no alarm, false alarm of pressure-sensitive sensor, etc., to improve the qualified rate, the effect of preventing batch accidents
Active Publication Date: 2018-03-20
HITECH SEMICON WUXI
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Problems solved by technology
Traditional equipment uses pressure-sensitive sensors for pressure testing. The pressure is between 3-4N, and the alarm is recognized when it is greater than 4N. Since the thickness of BOC (board on chip) products is 250 microns and the thickness of glue is 30 microns, it is suitable to use pressure-sensitive sensors, but at present Some POP (package on package) chip products have a thickness of 110 microns and a glue thickness of 20 microns. It is difficult for pressure-sensitive sensors to identify false alarms or no alarms, resulting in batch accidents and a decline in the pass rate.
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[0017] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.
[0018] like figure 1 As shown, the present invention provides a chip adhesion detection device 1, which is installed in chip manufacturing equipment. The device 1 includes: a thickness measuring sensor 11 , a comparator 12 , and a controller 13 .
[0019] The thickness m...
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The invention provides a chip adhesion detection device which is arranged on a chip manufacturing device. The chip adhesion detection device comprises at least one thickness measurement sensor, a comparator and a controller, wherein the thickness measurement sensor is used for measuring the thickness of a chip obtained after a chip adhesion working procedure is carried out and correspondingly generating a thickness electric signal, the comparator is connected with the output end of the thickness measurement sensor and used for comparing the value of the thickness electric signal with a preset threshold value and outputting a first triggering electric signal when the value is larger than the threshold value, and the controller is connected with the output end of the comparator and used for controlling the working state of the chip manufacturing device when the first triggering electric signal is received. According to the chip adhesion detection device, the non-contact type thickness measurement sensor is adopted, the double-chip condition can be timely found, batch accidents are accordingly prevented, and the percent of pass is improved.
Description
technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a chip adhesion detection device. Background technique [0002] In the semiconductor manufacturing process, due to the different levels of training and negligence of employees, the D / A (Die Attach) project will perform D / A again on the products that have been operated. Traditional equipment uses pressure-sensitive sensors for pressure testing. The pressure is between 3-4N, and the alarm is recognized when it is greater than 4N. Since the thickness of BOC (board on chip) products is 250 microns and the thickness of glue is 30 microns, it is suitable to use pressure-sensitive sensors, but at present Some POP (package on package) chip products have a thickness of 110 microns and a glue thickness of 20 microns. It is difficult for pressure-sensitive sensors to identify false alarms or no alarms, resulting in batch accidents and a decline in the pass rate. Conten...
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IPC IPC(8): H01L21/67
CPCH01L21/67H01L22/30H01L22/34
Inventor 梅雪军
Owner HITECH SEMICON WUXI