Partial mixed lamination board dislocation prevention method

Abstract

The invention provides a partial mixed lamination board dislocation prevention method comprising daughter and mother board preprocessing steps and a daughter board and mother board mixed lamination step. The following step is performed after the daughter board preprocessing step: multiple grooves are formed on at least one edge of a daughter board; the following step is performed after the mother board preprocessing step: convex blocks, which are matched and inserted into the grooves, are formed on the corresponding edges of the cavity, which is suitable for embedding of the daughter board, of a mother board; the following step is performed before the daughter board and mother board mixed lamination step: the daughter board and mother board are positioned in an embedded way via mutual plugging and matching of the grooves and the convex blocks; and the daughter board is fixed and adhered on the mother board via lamination gel. According to the method, the daughter board and mother board are positioned in the embedded way via mutual matching of the grooves and the convex blocks so that the daughter board and mother board can be accurately positioned, relative displacement is not generated in the lamination process due to accurate positioning, and thus manufacturing quality of the mixed lamination board manufactured by using the method is high and rejection rate is low.

Description

technical field [0001] The invention relates to a mixed pressure plate, in particular to a design for preventing local mixed pressure plates from dislocation. Background technique [0002] In the process of manufacturing local high-frequency mixed-pressed PCB boards, usually only high-frequency materials need to be used locally. In production, local high-frequency material sub-boards are often mixed with ordinary material mother boards, but when the two are pressed together , because there is no positioning structure, it is easy to shift during operation, resulting in the problem of poor alignment between the sub-board and the motherboard, and in serious cases, it will cause the PCB board to be scrapped because of the misalignment of the board. [0003] In order to solve the above problems, the Chinese patent literature discloses a method for manufacturing a mixed-pressure printed circuit board, which includes: a high-frequency material daughter board, a mother board, and a ...

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Problems solved by technology

[0005] For this reason, the technical problem to be solved by the present invention is that in the prior art, during the pressing process of the PCB board, the sub-board and the mother board are prone to misalignment, resulting in poor production quality of the PCB board, and then providing a high-quality production prevention Dislocation design of partial mixed pressure plate

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