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COA substrate and manufacturing method thereof

A manufacturing method and substrate technology, applied in semiconductor/solid-state device manufacturing, optics, instruments, etc., can solve problems such as air bubbles affecting the display effect, and achieve the effect of improving the display effect

Active Publication Date: 2015-04-29
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a COA substrate and its manufacturing method to solve the technical problem that the residual air bubbles in the via holes affect the display effect in the prior art

Method used

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  • COA substrate and manufacturing method thereof
  • COA substrate and manufacturing method thereof
  • COA substrate and manufacturing method thereof

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Embodiment Construction

[0046] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present invention can be practiced. The directional terms mentioned in the present invention, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", etc., are for reference only The orientation of the attached schema. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention. In the figures, structurally similar units are denoted by the same reference numerals.

[0047] Please refer to figure 2 , figure 2 It is a schematic structural diagram of the COA substrate of the first embodiment of the present invention.

[0048] COA substrate of the present invention such as figure 2 As shown, it includes a base substrate 11, a first metal layer 12, a gate insulating layer 13, an active layer 14, an ohmic contact layer 15, a sec...

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PUM

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Abstract

The invention provides a COA substrate and a manufacturing method thereof. The method comprises the following steps: a first metal layer, a grid insulation layer, an active layer, an Ohmic contact layer, a second metal layer, a first passivation layer, a color resistance layer, a second passivation layer, a via hole and a transparent conducting layer are successively formed on a substraum substrate, wherein the first metal layer is schematized to form a grid, and the second metal layer is schematized to form a drain electrode and a source electrode; the via hole is used for connecting the pixel electrode of the transparent conducting layer to the drain electrode of the second metal layer; a spacing block and / or a black matrix is formed on the surface of the COA substrate, and the via hole is filled with organic materials of the spacing block materials or the black matrix materials. For the COA substrate and the manufacturing method thereof, disclosed by the invention, when the spacing block and / or the black matrix is formed, the via hole is filled with the spacing block materials or the black matrix materials, so that the showing effect is improved, and the production cost is reduced.

Description

【Technical field】 [0001] The invention relates to the technical field of liquid crystal displays, in particular to a COA substrate and a manufacturing method thereof. 【Background technique】 [0002] COA (Color Filter on Array) substrate is to make color filters on the array substrate, please refer to figure 1 , figure 1 It is a structural schematic diagram of a COA substrate in the prior art, such as figure 1 As shown, the existing COA substrate includes a base substrate 111, a first metal layer 112, a gate insulating layer 113, an active layer 114, an ohmic contact layer 115, a second metal layer 116, and a first passivation layer 117; The resistance layer 118, the second passivation layer 119, the transparent conductive layer 120, the transparent conductive layer 120 includes a pixel electrode, and the pixel electrode is connected to the drain of the second metal layer through the via hole 121 penetrating the color resistance layer 118 and the second passivation layer 11...

Claims

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Application Information

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IPC IPC(8): H01L27/12H01L21/77G02F1/1335G02F1/1333
CPCH10K59/00
Inventor 宋利旺
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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