Layout structure and manufacturing method of trench type super junction device
A layout structure and super junction technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as device failure, and achieve the effect of avoiding wafer warping
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[0018] see Figure 4a , which is Embodiment 1 of the present application. In each die there are multiple trenches for forming pillars, all indicated by black lines. Adjacent and parallel grooves form a plurality of square groove arrays, and the groove arrays are approximately the same size. The arrangement directions of two adjacent groove arrays are perpendicular to each other no matter in the horizontal direction or in the vertical direction.
[0019] see Figure 4b , which is the second embodiment of the present application. It differs from Embodiment 1 only in that the shape of the groove array is either square or rectangular, and the size of the groove array is different.
[0020] Since the present application has an array of trenches perpendicular to each other in a crystal grain, the manufacturing process of the layout structure of this special trench-type super junction device is as follows: Figure 5a to Figure 5c As shown, take the manufacture of super junction ...
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