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8results about How to "Offset stress" patented technology

Pre-sealing advanced water stop grouting device and method

The invention relates to the technical field of settlement post-cast strips, in particular to a pre-closed advanced water stop grouting device and method.The pre-closed advanced water stop grouting device comprises a basement top plate, a bottom plate, a cover plate and a grouting sleeve and further comprises a self-adaptive adjusting assembly; the self-adaptive adjusting assembly comprises an inner cylinder, an outer cylinder, a spring, a sealing ring and a pre-tightening force adjusting component, and when the building body settles, the cover plate descends to drive the outer cylinder to descend, and then the spring is extruded; the springs on the two sides generate reverse buffering force after being compressed, the force is transmitted to the cover plate through the outer cylinder, the internal stress of the cover plate caused by differential settlement is effectively counteracted, and it is avoided that a sealing structure at the joint of the cover plate and a basement top plate cracks due to rigid pulling; and after the settlement is stable, pressure grouting is performed through the grouting sleeve, so that the problems of cracking of the cover plate and failure of sealing structures such as a sealant and a waterproof coiled material due to rigid pulling are solved.
Owner:WUHAN YUCHENG JIUFANG CONSTR CO LTD

Vacuum-assisted compression molding method and mold for nano microporous insulation panel

The invention relates to a vacuum-assisted compression molding method and mold for a nano microporous insulation panel, and the method comprises the following specific steps: S1, preparing a composite glass fiber cloth bag: uniformly mixing organosilicon modified epoxy resin, hydrophobic nano silicon dioxide, diethylenetriamine, an amino silane coupling agent, polyethylene glycol and acetone to prepare coating slurry, and carrying out vacuum compression molding on the composite glass fiber cloth bag to prepare the composite glass fiber cloth bag; dipping a glass fiber cloth bag in the coating slurry to obtain a composite glass fiber cloth bag; s2, preparing composite powder: mixing and stirring fumed silica, an opacifying agent and high silica fibers to obtain nano-microporous composite powder; s3, the pressing forming mold is positioned and overturned; s4, vertically and flatly spreading the cloth bag; s5, charging and sealing; s6, the mold frame is overturned; and S7, compression molding. Through the synergistic effect of the microporous coating structure of the composite glass fiber cloth bag and the vacuum-assisted compression molding process, the nano microporous heat insulation plate which is high in flatness, free of wrinkles, uniform in edge core density and excellent in heat insulation performance is prepared.
Owner:NANTONG ECOTHERM INSULATIONS CO LTD

Plastic steel door and window with reinforcing rib inside

The utility model relates to door and window technical field, concretely is the plastic steel door and window with the reinforcing rib in the inside, including the window frame, the inside installation of window frame has the window sash, the window sash is connected with the inside glass through the antiskid batten and installs, the inside of window frame is provided with the reinforcing rib net, the inside wall of window frame is connected with the outside wall of steel lining and installs, the inside of window frame is placed with the reinforcing angle steel. The improved plastic steel door and window, through the inside layer of window frame and add the reinforcing rib net, make the window frame outer frame and the reinforcing rib net in the inside form the overall structure, can effectively prevent the frame body to crack phenomenon, and in the inside of window frame and the window frame corner place are provided with the steel lining and the reinforcing angle steel, can effectively promote the structure strength of window frame whole, solved the existing plastic steel door and window window frame corner place easy to crack, the overall structure strength is low and the problem that easy window frame is received temperature change frame body expansion and contraction, is applicable to the climate changeable area building.
Owner:QINGHAI YINGXIN ENERGY SAVING DOORS & WINDOWS CO LTD

Aluminum-plastic composite film and method for manufacturing the same

The present application provides an aluminum-plastic composite film and a preparation method thereof. The aluminum-plastic composite film comprises an aluminum foil layer, a protective layer on one side of the aluminum foil layer, and a heat-seal layer on the other side of the aluminum foil layer. The heat-seal layer is made of a thermoplastic resin material, and the protective layer is made of a heat-resistant resin material. The protective layer comprises a nylon layer close to the aluminum foil layer and a polyethylene terephthalate layer away from the aluminum foil layer. The thickness ratio of the heat-seal layer to the protective layer is less than 2.5, and the thickness ratio of the nylon layer to the polyethylene terephthalate layer in the protective layer is 3-6. The aluminum-plastic composite film of the present application controls the thickness ratio of each layer made of a heat-resistant resin material and a thermoplastic resin material in a specific way, so that the stress on the side of the heat-resistant resin material can offset the stress on the side of the thermoplastic resin material, and the thickness ratio of the nylon layer to the polyethylene terephthalate layer is controlled to ensure the punching performance, thereby realizing an aluminum-plastic composite film with low curling.
Owner:JIANGXI SHENGWEI MATERIAL CO LTD +1

Anti-deformation welding device for stainless steel grid plate

The utility model relates to stainless steel grating plate welding technical field discloses a kind of stainless steel grating plate anti-deformation welding devices, including base, the inner wall of base is equipped with clamping mechanism, the clamping mechanism is used to clamp grid plate, the top of the clamping mechanism is equipped with support mechanism, and the support mechanism is used to support grid plate;The clamping mechanism includes fixed plate, and the fixed plate is fixedly connected in the inner wall of base upper portion.In the utility model, motor rotation drives connecting block rotation, connecting block rotation pulls connecting plate, connecting plate pulls slider to thereby drive long plate to move left and right in the outer wall of slide rail, long plate moves and pulls support arm, so that support arm drives rotation of pivot, pivot rotation makes the clamping plate of support arm top gather in the middle, so that the outer wall of clamping plate is always attached to the both sides of grid plate, prevent grid plate position deviation from leading to deformation when welding, fixed rod can adapt to grid plate of different height, improve use range.
Owner:WUXI MAOYUAN METAL STRUCTURAL PARTS CO LTD

A black radiation-cooling thin film and its preparation method

This invention discloses a black radiation-cooling thin film and its preparation method. The thin film comprises, from bottom to top, a substrate Sub, a black reflective module, and a radiation module. The structure of the black reflective module, from bottom to top, is MD1AD2, where M is a metal layer, D1 is a first dielectric layer, A is a visible light absorption layer, and D2 is a second dielectric layer. The structure of the radiation module, from bottom to top, is (A'1A'2A'3). s L, where A'1, A'2, and A'3 are the first, second, and third absorption layers, respectively, which have absorption in the 8μm-13μm band and high transmission in the 0.3μm-2.5μm band; L is a low refractive index protective layer; and s is the number of stacked periods, s≥1. This invention achieves good cooling performance while maintaining a black color.
Owner:XIAMEN UNIV

Wafer-level PCB packaging structure and PCB packaging method

The invention provides a wafer-level PCB (Printed Circuit Board) packaging structure and a PCB packaging method. The wafer-level PCB packaging structure comprises a packaging wafer and a PCB carrier plate, a metal connecting terminal is arranged on the upper surface of the PCB carrier plate, and the packaging wafer is connected with the PCB carrier plate through the metal connecting terminal; a plurality of pressure sensors are arranged in the packaging wafer and are used for monitoring stress generated in the wafer; a plurality of piezoelectric ceramic units are embedded in the PCB support plate, and the piezoelectric ceramic units are electrically connected with the metal connecting terminals; a controller is arranged in the functional chip in the packaging wafer, is electrically connected with the plurality of pressure sensors and the plurality of piezoelectric ceramic units, and is used for controlling the voltage of the piezoelectric ceramic units according to the stress monitored by each pressure sensor; therefore, the piezoelectric ceramic unit generates deformation compensation to counteract the stress inside the wafer. According to the invention, the structure risk caused by stress can be eliminated while high integration, shorter interconnection and thinner packaging are realized.
Owner:HYGON INFORMATION TECH CO LTD

Restraining separator, restraining pressurizing device, and pouch battery production method

This application relates to the field of pouch battery manufacturing technology and provides a restraining separator, a restraining pressurization device, and a pouch battery production method. The restraining separator of this application includes a separator body. At least one side of the separator body in the thickness direction has a groove, which is adapted to the large surface of the pouch battery. The groove has a connected planar portion and a concave arc portion, with the concave arc portion surrounding the circumference of the planar portion and smoothly transitioning to the planar portion. Along a first direction of the separator body, one side of the concave arc portion corresponds to the electrode thinning area in the pouch battery. When the pouch battery is restrained and pressurized, the restraining separator of this application ensures that the planar portion and the concave arc portion are in full contact with the large surface of the battery. The structure of the concave arc portion effectively suppresses the expansion of the electrode thinning area, counteracts the stress generated by the central area of ​​the large surface on the edges, and ensures uniform stress on the edges of the pouch battery, thereby helping to prevent electrode edge cracking.
Owner:SVOLT ENERGY TECHNOLOGY CO LTD