Chip packaging method and wafer manufactured through chip packaging method
A chip packaging and wafer technology, used in semiconductor/solid-state device manufacturing, printing devices, printing, etc., can solve problems such as chip overflow, and achieve the effect of avoiding wafer warpage and avoiding the separation of adhesive and chip.
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[0032] The specific implementation of the chip packaging method provided by the present invention will be described in detail below in conjunction with the accompanying drawings.
[0033] Figure 4 A schematic diagram of the steps of the chip packaging method of the present invention is shown. see Figure 4 , the chip packaging method includes the following steps: step S40, providing a wafer, the front of the wafer has a plurality of chips; S41, printing a chip adhesive on the back of each chip of the wafer with a screen, the screen has Multiple holes, each corresponding to a chip position; S42, dicing the wafer into multiple individual chips, each chip has an adhesive on the back; S43, providing a lead frame, and passing the chip through the bonding on the back paste on the lead frame; S44, wire bonding; S45, plastic packaging.
[0034] Figure 5A Shown is a schematic diagram of the wafer structure used in the present invention, and a plurality of chips 501 are distribute...
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