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Server

A server and side plate technology, applied in the field of servers, can solve problems such as decreased heat dissipation efficiency

Active Publication Date: 2015-06-03
INVENTEC PUDONG TECH CORPOARTION +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a server, so as to solve the problem of the heat dissipation efficiency drop caused by the backflow of the airflow when the fan module needs to be replaced

Method used

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Embodiment Construction

[0062] Below in conjunction with accompanying drawing, structural principle and working principle of the present invention are specifically described:

[0063] Please refer to figure 1 , figure 1 It is an exploded view of the structure of the server according to an embodiment of the present invention.

[0064] The server 1 of this embodiment includes a main chassis 10 , a fan module 20 , a guide rail assembly 30 and an air guide cover 40 .

[0065] The main chassis 10 includes a top plate 11 and a bottom plate 12 opposite, a first side plate 13 and a second side plate 14 opposite, the first side plate 13 and the second side plate 14 are interposed between the top plate 11 and the bottom plate 12 , the top board 11 , the bottom board 12 , the first side board 13 and the second side board 14 form an accommodating space 15 . The rail assembly 30 includes four first rails 31 and four second rails 32 . The four first guide rails 31 are respectively disposed on the first side pa...

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PUM

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Abstract

The invention discloses a server. The server comprises a mainframe box, a fan module and an air director; the mainframe box has a top plate and a bottom plate opposite to each other, and a first lateral plate and a second lateral plate opposite to each other, the first lateral plate and second lateral plate are located between the top plate and bottom plate, and the top plate, bottom plate, first lateral plate and second lateral plate form a holding space; the fan module can move relative to the mainframe box so as to form a storage position and a drawing position, at the storage position, the fan module is located in the holding space, and at the drawing position, the fan module is located outside the mainframe box, and a gap remains between the fan module and the mainframe box; the air director is movably arranged at the mainframe box; when the fan module moves to the drawing position from the storage position, the air director moves to the outside of the mainframe box from the inside of the mainframe box so as to cover the gap between the fan module and the mainframe box.

Description

technical field [0001] The invention relates to a server, in particular to a server with a wind guide cover. Background technique [0002] As the number of electronic components in the server increases, the heat generated by the electronic components will also increase significantly. Therefore, it is necessary to increase the number of fans in the fan module in the server. However, when a single fan in the fan module fails and needs to be replaced, it is necessary to pull the fan module out of the main chassis of the server. However, once the fan module is pulled out from the main chassis, there will be a gap between the fan module and the main chassis. This gap will cause the airflow to flow back and prevent the airflow from flowing into the main chassis of the server, thereby causing the electronic components in the main chassis to dissipate heat. Abnormal and affect the normal operation of electronic components. [0003] Therefore, without affecting the normal operatio...

Claims

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Application Information

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IPC IPC(8): G06F1/20G06F1/18
Inventor 陈伟仕
Owner INVENTEC PUDONG TECH CORPOARTION