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A kind of puncture-resistant packaging film and its preparation method

A packaging film and puncture-resistant technology, which is applied in the direction of chemical instruments and methods, layered products, synthetic resin layered products, etc., can solve the problems of impervious to puncture and easy-leaving layers, and achieve reduced package breakage, superior mechanical properties, The effect of the appropriate coefficient of friction on the membrane surface

Active Publication Date: 2017-08-01
GUANGDONG XINGGE NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the above deficiencies in the prior art, the present invention provides a puncture-resistant packaging film and a preparation method thereof. The puncture-resistant packaging film is a three-layer co-extruded plastic film suitable for hardware packaging. Compared with the composite film for packaging, it has the advantages of superior mechanical properties and appropriate friction coefficient of the film surface. It aims to solve the problems that the existing composite film used for hardware packaging is easy to delaminate and not resistant to puncture.

Method used

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  • A kind of puncture-resistant packaging film and its preparation method
  • A kind of puncture-resistant packaging film and its preparation method

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Embodiment 1

[0038] The puncture-resistant packaging film was prepared according to the above process. In this embodiment, the total thickness of the puncture-resistant packaging film was 60 μm, the thickness of the outer film layer was 16.8-21 μm, and the thickness of the middle film layer was 9-19.2 μm. The thickness of the inner film layer is 24-30 μm (because the thickness of the co-extruded film cannot be measured accurately, the values ​​given in the examples are ranges). Among them, the composition of the middle film layer is m-LLDPE and HDPE, and the mass parts are 50 parts and 50 parts respectively; the composition of the inner film layer is m-LLDPE, LDPE and POE, and the mass parts are 50 parts, 20 parts, and 30 parts . The main technical indicators of this embodiment are shown in Table 1.

Embodiment 2

[0040] Prepare the puncture-resistant packaging film according to the above process. In this embodiment, the total thickness of the puncture-resistant packaging film is 80 μm, the thickness of the outer film layer is 22.4-28 μm, and the thickness of the middle film layer is 12-25.6 μm. The thickness of the inner film layer is 32-40 μm. Among them, the composition of the middle film layer is m-LLDPE and HDPE, and the mass parts are 50 parts and 50 parts respectively; the composition of the inner film layer is m-LLDPE, LDPE and POE, and the mass parts are 60 parts, 20 parts, and 20 parts .

[0041] The main technical indicators of this embodiment are shown in Table 1.

Embodiment 3

[0043] Prepare the puncture-resistant packaging film according to the above process. In this embodiment, the total thickness of the puncture-resistant packaging film is 70 μm, the thickness of the outer film layer is 19.6-24.5 μm, and the thickness of the middle film layer is 10.5-22.4 μm , the thickness of the inner film layer is 28-35 μm. Wherein, the composition of middle layer film layer is m-LLDPE and HDPE, and mass parts are respectively 60 parts, 40 parts; The composition of inner layer film layer is m-LLDPE, LDPE and POE, and mass parts are respectively 50 parts, 20 parts, 30 parts share.

[0044] The main technical indicators of this embodiment are shown in Table 1.

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Abstract

The invention discloses a puncture-resistant packaging film and a preparation method thereof. The puncture-resistant packaging film adopts a three-layer composite structure consisting of an outer thin film layer, a middle thin film layer and an inner thin film layer, wherein the outer thin film layer is prepared from high-density polyethylene; the middle thin film layer is prepared from high-density polyethylene and metallocene linear low-density polyethylene; the inner thin film layer is prepared from metallocene linear low-density polyethylene, low-density polyethylene and a polyolefin elastomer. Compared with a conventional hardware packaging composite film, the puncture-resistant packaging film has the advantages of excellent mechanical property, proper film surface friction coefficient and the like and is suitable for any automatic packaging equipment.

Description

technical field [0001] The invention relates to the field of packaging films, in particular to a puncture-resistant packaging film and a preparation method thereof. Background technique [0002] The packaging materials used in the traditional hardware industry are composite films, which are prepared by compounding various single-layer films with adhesives. However, this kind of composite film has the disadvantages of easy detachment and imperviousness to puncture, which makes the package of hardware parts break during transportation. [0003] Therefore, the prior art still needs to be improved and developed. Contents of the invention [0004] In view of the above deficiencies in the prior art, the present invention provides a puncture-resistant packaging film and a preparation method thereof. The puncture-resistant packaging film is a three-layer co-extruded plastic film suitable for hardware packaging. Compared with the composite film for packaging, it has the advantage...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/32B32B27/18B29C47/38B29C48/395
CPCB29C48/395B32B27/08B32B27/18B32B27/32B32B27/327
Inventor 梁伟信潘小龙
Owner GUANGDONG XINGGE NEW MATERIAL CO LTD