Small-sized chip type surface mounting (SMD) high-voltage and safety standard recognized ceramic capacitor

Abstract

The invention relates to a small-sized hip type surface mounting (SMD) high-voltage and safety standard recognized ceramic capacitor and a manufacturing method thereof. The capacitor comprises holosymmetrical copper electrode ceramic chips, a copper belt pin and an encapsulating material, wherein the holosymmetrical copper electrode ceramic chips are cylindrical; a ceramic medium is positioned between upper and lower electrodes which are integral copper electrodes; the copper belt pin is welded and fixed with the upper and lower electrodes; the encapsulating material is used for encapsulating the copper electrode ceramic chips and one part of the copper belt pin together, and the tail end of the copper belt pin is exposed out of the encapsulating material. The manufacturing method for the capacitor comprises the following steps: inserting chips, welding, vacuum injection-molding and encapsulating epoxy resin, curing and molding at a high temperature, laser-printing product performance information and safety certification information, cutting a pin, performing full-automatic performance test, taping and packaging a reel. The capacitor has the characteristics of being stable in capacity, high in electric strength and small in size, effectively saves the surface space of a PCB (printed circuit board), and is suitable for existing small-sized and ultrathin requirements of a whole circuit of an electrical appliance product, so that the market needs are met.

Description

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AI Technical Summary

Benefits of technology

This patented technical effect of this innovation relates to making better quality electronic components by reducing their sizes while maintaining their functionality. It achieves these benefits through use of specialized chips that have improved properties such as higher voltage ratings or less expensive material compared to older designs. These improvements result from reduced manufacturing costs without sacrificing reliability due to smaller dimensions.

Problems solved by technology

This patented technical problem addressed in this patents relates to improving upon conventional methods used during electronics assembly that require large amounts of space due to their bulky design or requiring expensive material processing techniques like sintered metal powders.

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