Ball replenishing device and method for surface array bump ball planting process

Abstract

The invention relates to a ball adding device and a ball adding method of an area array bump ball implanting technology. The ball adding device of the area array bump ball implanting technology comprises a wafer carrying motion unit (1) used to place and position a wafer (100), an added ball carrying motion unit (2), and a vision CCD (charge coupled device) unit (70), a glue dispensing unit (80), a solder ball removal unit (50) and a solder ball implanting unit (60), which are fixedly connected onto the added ball carrying motion unit (2), and further comprises a solder ball feeding unit (40), a glue supply unit (10), a waste ball collection unit (30) and a cleaning unit (20), which are arranged on one side of the added ball carrying motion unit (2), wherein the wafer carrying motion unit (1) moves along the Y direction, and rises and falls along the Z direction, and the added ball carrying motion unit (2) moves along the X direction, the Y direction and the Z direction, and rotates along the Z direction. Compared with the prior art, the ball adding device and the ball adding method of the area array bump ball implanting technology can guarantee ball implanting quality, and improve ball implanting efficiency of the area array bump ball implanting technology.

Description

technical field [0001] The invention relates to the field of ball planting, in particular to a ball replenishing device and method for an area array bump ball planting process. Background technique [0002] BGA (Ball Grid Array), CSP (Chip Size Package) and WLP (Wafer Level Package) are the mainstream packaging forms in the market. There are many ways to manufacture bumps, mainly including electroplating process, screen printing process and ball planting process. Due to its advantages of low cost, high performance and good compatibility with SMT (Surface Mount Technology), the ball planting process is widely used in the advanced packaging process of area array bumps. Products with planted balls may have defects such as less balls, more balls, hammers and ball offsets, which are the outstanding shortcomings of the ball planting method. At present, the repair of these defects is done manually with the help of high-power magnifying glass and vacuum suction pen, which is ineff...

AI Technical Summary

Problems solved by technology

[0004] 1-Manually filling the ball, the production efficiency is low and the production capacity is affected

[0005] 2- People are in direct contact with substrates, wafers and other carriers, which is easy to contaminate the product, and the product is polluted, which seriously reduces the quality of the product

[0006] 3- People are in repeated contact with substrates, wafers and other carriers, especially the risk of wafer fragmentation is greatly increased. Once fragmentation occurs, the cost and loss are extremely high

[0007] 4- People hold the adsorption pen to fill the ball, which is easy to make mistakes and damage the substrates, wafers and other carriers that have been planted, causing the ball planting products to be reworked, wasting man-hours

[0008] 5-The trend of IC miniaturization is intensifying. The ball diameter required for the ball planting process required by substrates, wafers and other carriers is getting smaller and smaller, and the ball pitch is getting finer. It is almost impossible to do it manually

But this patent can't realize the supplementary ball operation

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