Probe measuring system

Abstract

The invention discloses a probe point measurement system, comprising a lifting table, at least one probe apparatus, at least one deformation sensing loop, a contact sensing loop, a test loop, a first switch and a second switch. The lifting table is used for carrying a to-be-tested object. The probe apparatus is positioned above the lifting table. The probe apparatus comprising a moment arm, a probe and at least one sensing element. One end of the moment arm is connected to the probe. The sensing element is on the moment arm. When the moment arm is deformed by bearing a force, the sensing element generates observed value change along the deformation of the moment arm. The deformation sensing loop is electrically connected with the sensing element and used for receiving the observed value change. The contact sensing loop comprises a power supply and a probe pressure sensing unit. The probe pressure sensing unit is electrically connected with the power supply, and has a pressure increasing element and a probe connection line. The probe spot measurement system shortens the time for detecting the to-be-tested object through the contact sensing loop, and ensures that the probe abuts against the to-be-tested object at a preset probe pressure through the deformation sensing loop.

Description

technical field [0001] The invention relates to a probe point measuring system. Background technique [0002] The traditional edge sensor (edge ​​sensor) must manually adjust the tightness of the elastic element (such as a spring), and then adjust the needle pressure of the probe. When the stage carrying the wafer rises up to touch the probe of the edge finder, the probe will be supported by the wafer and move upward. If the probe does not have enough needle pressure, the contact with the wafer will be poorly contacted, and the measurement data of the wafer will be inaccurate. In addition, if the needle pressure of the probe is too large, it is easy to damage the probe or cause damage to the wafer surface. [0003] It takes a period of time (for example, 20 ms) to confirm whether the probes are actually in contact with the wafer when the probes of the traditional edge finder touch the wafer, so it is difficult to shorten the detection time. In addition, when some of the p...

AI Technical Summary

Problems solved by technology

If the probe does not have enough needle pressure, there will be poor contact with the wafer, making the measurement data of the wafer inaccurate

In addition, if the needle pressure of the probe is too large, it is easy to damage the probe or cause damage to the wafer surface

[0003] When the traditional edge finder touches the wafer with its probe, it takes a period of time (for example, 20ms) to confirm whether the probe is in contact with the wafer, so it is not easy to shorten the detection time

In addition, when some of the probes on the existing edge finder are not on the same level, some of the probes are in contact with the wafer, but the other part of the probes are still suspended above the wafer

The user cannot know how to adjust the vertical height of the probe from the existing edge finder

[0004] When the probes of the existing edge finder are all at the same vertical height, the user cannot know the height of the pad of a single wafer or the thickness difference between multiple wafers during the measurement of the edge finder. For incoming materials Wafer abnormalities are also difficult to find

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