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Lift pin assembly and substrate processing apparatus having the same

A technology for processing equipment and assemblies, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., and can solve problems such as difficulties in supporting substrates, unstable plasma, substrate damage or breakage, etc.

Active Publication Date: 2015-06-24
JUSUNG ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Properly supporting a substrate can be difficult when the ejector pin is damaged
As a result, in the case of plasma processing equipment, the plasma can be unstable
In addition, when the ejector pin is damaged, the operation of the equipment must be stopped for replacement of the damaged ejector pin
Therefore, productivity may decrease, and the substrate seated on the ejector pin may be damaged or broken
Moreover, when the substrate is damaged, other components of the substrate processing equipment may be sequentially damaged by the plasma

Method used

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  • Lift pin assembly and substrate processing apparatus having the same
  • Lift pin assembly and substrate processing apparatus having the same
  • Lift pin assembly and substrate processing apparatus having the same

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Embodiment Construction

[0039] Hereinafter, specific embodiments will be described in detail with reference to the accompanying drawings. However, this invention may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0040] figure 1 is a cross-sectional view of a substrate processing apparatus according to an exemplary embodiment, figure 2 is a partial cross-sectional view illustrating a coupling state between an ejector pin assembly and a substrate support according to an exemplary embodiment, and image 3 is a cross-sectional view of an ejector pin assembly according to an exemplary embodiment.

[0041] refer to figure 1 , the substrate processing apparatus according to an exemplary embodiment may include: a reaction chamber 100 having a predetermined reaction space; ...

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Abstract

The invention relates to a lift pin assembly and a substrate processing apparatus having the same. The lift pin assembly comprises a first lift pin and a second lift pin. At least a part of the first lift pin supports the bottom surface of the substrate. The lift pin assembly is liftable. The second lift pin is configured to guide the first lift pin and is lifted through a substrate supporting member.

Description

technical field [0001] The present invention relates to an ejector pin assembly, and more particularly, to an ejector pin assembly capable of preventing damage to an ejector pin and a substrate processing apparatus having an ejector pin assembly. Background technique [0002] Generally, a process for manufacturing a semiconductor device or a liquid crystal display device includes: a thin film deposition process for depositing a thin film formed of a dielectric material on a wafer or a glass substrate; A photosensitive material is used to expose selected areas of the film; an etching process, which removes the film in selected areas, thereby forming the desired pattern; and a cleaning process, which removes the residue. Here, the process described above has to be repeated. Also, each of the processes may be performed within a reaction chamber in which an optimal environment is created to perform the corresponding process. [0003] A substrate support for supporting a substr...

Claims

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Application Information

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IPC IPC(8): H01L21/687H01L21/683
CPCH01L21/683H01L21/687H01L21/68742H01L21/68785
Inventor 金映绿姜泰薰柳寅瑞
Owner JUSUNG ENG
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