Low-temperature infrared radiation panel

An infrared radiation plate and infrared radiation technology, applied in the field of infrared radiation application, can solve the problems of inconvenient transportation, loss, slow internal drying, etc., and achieve the effect of reasonable and simple structure design, low production cost and wide application range

Inactive Publication Date: 2015-07-01
汇力恒通(厦门)远红外科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the drying process, especially the food processing process, has the following problems: surface dehydration and drying are fast, internal drying is slow, drying quality is poor, and energy consumption is high; it is difficult to achieve low-temperature drying, and it is necessary to increase the air temperature to achieve the purpose of increasing

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0047] Preferred embodiment 1: Low temperature infrared radiation panel packaging unit.

[0048] The insulating substrate is made of 200mm×300mm×7mm architectural glazed tiles, the number of low-temperature infrared radiating elements is 1, set in the packaging plastic frame (the plastic frame is made of ordinary temperature-resistant plastic), and the infrared radiation coating is prepared on the ceramic tile The stoneware surface is facing outward, the silver-based electrode, the inorganic electric heating layer and the conductive lead-out are prepared on the bright glaze surface of the ceramic tile facing inward. The conductive lead-out is connected with the power cord, and then 5 mm thick aluminum silicate insulation felt and 1 mm thick The artificial mica board is sealed and fastened with a lock. The electromechanical heating layer is made of graphite powder and fusible amorphous ceramic powder with a thickness of 0.2 mm. The silver-based electrodes and conductive terminals ...

Example Embodiment

[0049] Preferred embodiment 2: a double-sided heating low-temperature infrared radiation panel packaging unit.

[0050] Using 200mm×300mm×1.2mm artificial mica board as the insulating substrate, the number of low-temperature infrared radiation elements is two, all are set in the packaging plastic frame, the artificial mica board is prepared with the infrared radiation coating side outwards , The other side of the artificial mica board prepared with silver-based electrodes, inorganic electric heating layer and conductive lead-out ends faces inward, and the conductive lead-out ends are all connected to the power cord and fastened with locks. The electromechanical heating layer is made of graphite powder and fusible amorphous ceramic powder with a thickness of 0.3 mm. The silver-based electrodes and conductive terminals are made of silver powder and fusible amorphous ceramic powder. The power density of this embodiment is 0.15 W / cm², and the upper limit of the operating temperature ...

Example Embodiment

[0051] Preferred embodiment 3: Low temperature infrared radiation panel with thermocouple.

[0052] Use 200mm×300mm×5mm tempered glass as the insulating substrate, one side is prepared with infrared radiation coating, and the other side is prepared with silver-based electrode, inorganic heating layer and conductive terminal, in the gap position of the inorganic heating layer , Adopt a bonding process to fix a K-type thermocouple, and the conductive leads are connected to the power cord. The beneficial effect of this embodiment is that the K-type thermocouple is bonded and fixed and cooperated with the K-type temperature control instrument, which can easily realize temperature control and temperature adjustment of the drying equipment.

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Abstract

The invention relates to a low-temperature infrared radiation panel. The low-temperature infrared radiation panel comprises a low-temperature infrared radiation element and a packaging device. The low-temperature infrared radiation element is arranged in the packaging device and comprises an insulation substrate, an infrared radiation coating, silver base electrodes, inorganic electric heating layers and wire leading-out ends. The infrared radiation coating is prepared on the surface of one side of the insulation substrate, and the silver base electrodes, the inorganic electric heating layers and the wire leading-out ends are prepared on the surface of the other side of the insulation substrate. The low-temperature infrared radiation panel is concise and reasonable in design, and short-distance low-temperature face radiation is achieved; and in the low-temperature drying and water removing process of materials, the aim of even drying of the outside and the inside is achieved, original active substances, nutrient contents, the color, aroma and taste, flexibility and original forms are kept to the maximum limit, and the low-temperature infrared radiation panel is particularly suitable for low-temperature fine drying of high and mid grade materials such as tea leaves, bird's nests and Chinese herbal medicines.

Description

Technical field [0001] The invention relates to the technical field of infrared radiation application, in particular to a low-temperature infrared radiation panel. Background technique [0002] In daily life and industrial production, there is a need to dry various materials such as articles and food in order to achieve the purpose of extending the retention period. At present, thermal drying is commonly used, that is, air is used as the heat transfer medium. By increasing the temperature of the air, heat energy is transferred to the object to be dried to achieve drying and dehydration of the object. Commonly used are electric heating, fire heating, resistance wire heating, etc. These technologies are quite mature and easy to apply. However, the drying process, especially the food processing process, has the following problems: surface dehydration is fast, internal drying is slow, drying quality is poor, and energy consumption is high; it is difficult to achieve low-temperature ...

Claims

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Application Information

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IPC IPC(8): F26B23/06
Inventor 尹维平
Owner 汇力恒通(厦门)远红外科技有限公司
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