Use of microphones with vsensors for wearable devices
A technology for electronic equipment and users, applied in the field of audio processing and wearable equipment, which can solve the problems of low efficiency and high cost
Inactive Publication Date: 2015-07-15
DSP GROUP
View PDF0 Cites 26 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] Existing methods and systems for capturing audio in wearable electronic devices can be inefficient and / or expensive
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
other Embodiment approach
[0050] Other embodiments may provide a non-transitory computer-readable medium and / or storage medium, and / or a non-transitory machine-readable medium and / or storage medium having machine code and / or computer programs stored thereon, the The machine code and / or computer program has at least one code segment executable by the machine and / or computer, causing the machine and / or computer to perform the steps described herein of combining a microphone with a V-sensor for a wearable device.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more PUM
Login to view more
Abstract
Methods and systems are provided for use of microphones with VSensors for wearable devices. VSensors may be used to detect and / or capture vibrations in bones. The captured bone vibrations may then be used to improve audio related operations. For example, bone vibrations may correspond to user audio input (e.g., speech), and as such the captured bone vibrations may be used in enhancing noise reduction functions in the wearable devices, by enabling distinguishing user audio input, as captured by microphone(s), from ambient noise. This may obviate the need to move the wearable device closer to the user's mouth (such that embedded microphones would be closer). The captured bone vibrations may also be analyzed to determine if they correspond to user control input (e.g., by means of finger tapping), such as by comparing them against predefined patterns.
Description
[0001] priority statement [0002] This patent application references, and claims priority and benefits from, US Provisional Patent Application Serial No. 61 / 926,475, filed January 13, 2014, which is hereby incorporated by reference in its entirety. technical field [0003] Various aspects of this disclosure relate to audio processing. More specifically, certain implementations of the present disclosure relate to combining microphones with vibration sensors for wearable devices. Background technique [0004] Existing methods and systems for capturing audio in wearable electronic devices may be inefficient and / or expensive. Other limitations and disadvantages of conventional and conventional approaches will become apparent to those skilled in the art by comparing conventional and conventional approaches with some aspects of the present method and apparatus set forth in the remainder of this disclosure with reference to the accompanying drawings. Contents of the invention ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more Application Information
Patent Timeline
Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H04R3/02H04R1/08H03G3/20
CPCH04R2460/13G10K11/002H04R1/1041G10L25/78H04R1/46G10L21/02H04R1/1083H04M1/6041G10L21/0208
Inventor 阿里·海曼罗依·罗依米乌里·耶胡达
Owner DSP GROUP
Who we serve
- R&D Engineer
- R&D Manager
- IP Professional
Why Eureka
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Social media
Try Eureka
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap