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Production process of ultra-thin electromagnetic shielding film

A technology of electromagnetic shielding film and production process, applied in the fields of magnetic field/electric field shielding, electrical components, layered products, etc., to achieve the effect of simple process

Active Publication Date: 2018-06-15
广东桑泰科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the electromagnetic shielding effect of the thicker conductive shielding film is better than that of the thinner electromagnetic shielding film.

Method used

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  • Production process of ultra-thin electromagnetic shielding film
  • Production process of ultra-thin electromagnetic shielding film
  • Production process of ultra-thin electromagnetic shielding film

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] In order to describe the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.

[0022] Such as figure 1 As shown, the ultra-thin electromagnetic shielding film provided by the present invention includes a carrier layer 10, an adhesive layer 20, a conductive metal layer 30, an insulating layer 40, and a protective layer 50 arranged in sequence, wherein the adhesive layer 20 is reticular, at least partially The conductive metal layer 30 is filled in the mesh pores of the adhesive layer 20 . combine figure 2 Shown, more specifically:

[0023] The carrier layer 10 has a planar structure, which can be a release film or a release paper. When the ultra-thin electromagnetic shielding film provided by the present invention is put into use, the carrier layer 10 is torn off from the adhesive layer 20, and the side of the ult...

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Abstract

The invention discloses an ultrathin electromagnetic shielding membrane comprising a carrier layer, an adhesive layer, and a protective layer. The layers are successively arranged. The adhesive layer is in a netted shape; netted holes of the adhesive layer are filled with conductive metals to form conducive metal layers. According to the invention, the netted holes of the adhesive layer in a netted shape are filled with conductive metals and the conductive metal layer located in the netted holes of the adhesive layer form a netted electromagnetic shielding, so that an electromagnetic shielding effect is realized. Because the adhesive layer of the ultrathin electromagnetic shielding membrane is in a netted shape and the netted holes of the adhesive layer are filled with conductive metal layers for realizing the electromagnetic shielding effect, the thickness of the ultrathin electromagnetic shielding membrane can reach 8 microns below under the circumstances that the electromagnetic shielding effect is not affected. In addition, the invention also discloses a production technology of the ultrathin electromagnetic shielding membrane.

Description

technical field [0001] The invention relates to a shielding film technology for circuit boards, in particular to an ultra-thin electromagnetic shielding film and a production process thereof. Background technique [0002] For FPC circuit boards or other occasions that require electromagnetic shielding films to achieve electromagnetic shielding effects, the thinner the better, the thinner electromagnetic shielding films occupy less space and can effectively reduce the volume and weight of precision equipment. [0003] The electromagnetic shielding effect of the electromagnetic shielding film is mainly realized by the shielding layer made of conductive metal. However, the electromagnetic shielding effect of the thicker conductive shielding film is better than that of the thinner electromagnetic shielding film. Therefore, there is a dilemma between ensuring the electromagnetic shielding effect of the electromagnetic shielding film and the thickness requirements of the electrom...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K9/00B32B9/04B32B15/04B32B27/06B32B7/12
Inventor 李金明
Owner 广东桑泰科技有限公司
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