Bearing device, reaction chamber and semiconductor processing equipment

Abstract

The invention provides a bearing device, a reaction chamber and semiconductor processing equipment. The bearing device comprises a tray and auxiliary members. When a processed workpiece is not placed in first grooves, the first extension ends of the auxiliary members are higher than the bottom surfaces of the first grooves. In the process of placing the processed workpiece in the first grooves, the first extension ends are downwardly pressed by the gravity effect of the processed workpiece so that the first extension ends are enabled to rotate around the rotating shafts of the auxiliary members into second grooves and drive the second extension ends of the auxiliary members to rotate and rise around rotating shafts simultaneously. In the process that a manipulator acquires the processed workpiece in the first grooves, the second extension ends are downwardly pressed by the gravity effect of the manipulator so that the second extension ends are enabled to fall around the rotating shafts and drive the first extension ends to rotate and rise around the rotating shafts simultaneously, and thus the first extension ends are enabled to be jacked up by the processed workpiece. According to the bearing device, efficiency of processed workpiece absorption of the manipulator can be enhanced and accuracy of processed workpiece absorption of the manipulator can also be enhanced.

Description

technical field [0001] The invention belongs to the field of semiconductor equipment manufacturing, and in particular relates to a carrying device, a reaction chamber and semiconductor body processing equipment. Background technique [0002] In chemical vapor deposition (CVD) equipment, in order to increase the number of processed workpieces that can be processed in a single process and improve production efficiency, a tray that can carry multiple processed workpieces is usually set in the reaction chamber. And with the help of the manipulator, the pick-up or release of multiple workpieces to be processed is completed. [0003] figure 1 A top view of an existing pallet. figure 2 for figure 1 Sectional view of area I of the tray shown. Please also refer to figure 1 with figure 2 , the upper surface of the tray 10 is provided with a plurality of grooves spaced along its circumference, and each groove adopts a method such as figure 2 The stepped structure shown, that ...

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Problems solved by technology

[0004] However, the above-mentioned tray inevitably has the following problems in practical applications: in order to reduce the pollution and damage of the processed workpiece caused by the adsorption contact between the manipulator and the processed workpiece, the contact area between the manipulator and the processed workpiece is usually minimized , and this will cause such a problem, that is, once there is a deviation in the levelness of the upper surface of the tray 101 relative to the manipulator, there will be a problem that the contact area between the manipulator and the processed workpiece cannot correspond, resulting in the failure of the manipulator to take or put the film , thereby reducing production efficiency

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