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Wire tool with abrasive grains

A wire and belt grinding technology, which is applied in the manufacture of tools, stone processing equipment, grinding machines, etc., can solve the problems of quality deviation expansion, shape change deterioration, and no contribution, etc., to achieve the suppression of abnormal scratches, low manufacturing costs, and suppression of usage Effect

Inactive Publication Date: 2015-09-09
RIKEN CORUNDUM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, unnecessary abrasive grains that do not contribute to cutting or interfere with cutting are also fixed
Therefore, the price of the abrasive wire tool becomes expensive, and the cutting quality (unevenness of the cutting surface, shape change, etc.)

Method used

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  • Wire tool with abrasive grains
  • Wire tool with abrasive grains
  • Wire tool with abrasive grains

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0068] figure 1 and figure 2 It is a figure explaining the wire tool with abrasive grains in Embodiment 1 of this invention, figure 1 (a) is a side view, figure 1 (b) is the unfolded graph unfolded into a plane, figure 2 (a) is a cross-sectional view viewed from the front, and figure 2 (b) is a cross-sectional view enlargedly showing a cross-section viewed from the front. In addition, each figure is a figure drawn schematically, Embodiment 1 is not limited to the form shown in figure, and especially relative size (thickness) is exaggerated.

[0069] exist figure 1 and figure 2 Among them, a wire tool with abrasive grains (hereinafter referred to as "wire tool") 100 has a wire 1, an insulating layer 2 covering the outer peripheral surface of the wire 1, and a device that removes a part of the insulating layer 2 so that the outer peripheral surface of the wire 1 is peeled off. The via holes 3 and the abrasive grains 5 fixed to the via holes 3 by the via hole plating 4...

Embodiment approach 2

[0123] [Embodiment 2: Insulation removal type]

[0124] Figure 9 It is a figure explaining the wire tool with abrasive grains which concerns on Embodiment 2 of this invention, and is a cross-sectional view enlargedly showing the cross-section seen from the front. In addition, for Embodiment 1 ( figure 1 etc.) The same parts or corresponding parts are given the same symbols, and some explanations are omitted. Each figure is a figure drawn schematically, Embodiment 2 is not limited to the form shown in illustration, and especially the relative size (thickness) is exaggerated.

[0125] exist Figure 9 Among them, the abrasive wire tool (hereinafter referred to as "wire tool") 200 is the abrasive wire tool in which the insulating layer 2 covering the outer peripheral surface of the wire 1 of the wire tool 100 is removed after the abrasive grains 5 are fixed. That is, the via hole 3 does not exist as a “hole” but is replaced with the via hole plating 4 .

[0126] Therefore, t...

Embodiment approach 3

[0128] [Embodiment 3: Surface overall plating type]

[0129] Figure 10 It is a figure explaining the wire tool with abrasive grains which concerns on Embodiment 3 of this invention, and is a cross-sectional view enlargedly showing the cross-section seen from the front. In addition, for Embodiments 1 and 2 ( figure 1 etc.) The same parts or corresponding parts are given the same symbols, and some explanations are omitted. Each figure is a figure drawn schematically, and Embodiment 3 is not limited to the form shown in figure, and especially the relative size (thickness) is exaggerated.

[0130] exist Figure 10 Among them, the wire tool with abrasive grains (hereinafter referred to as "wire tool") 300 is coated with the wire 1 that becomes stripped in the wire tool 200 by plating (hereinafter referred to as "surface overall plating") 6 Wire tool with abrasive grains on the outer peripheral surface, the surface of the via hole plating 4, and the surface of the abrasive grai...

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PUM

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Abstract

The wire tool (100) with abrasive grains comprises a wire (1), and abrasive grains (5) fixed by electrification hole plating (4) in electrification holes (3), which are provided at multiple spots on the outer circumferential surface of the wire (1). The cylindrical electrification holes (3) are disposed on a helical curve (30) separated from each other by a uniform gap (G) and the gap (G) is larger than 1 / 3 of the radius (R) of the electrification holes (3).

Description

technical field [0001] The present invention relates to an abrasive-grained wire tool, in particular to an abrasive-grained wire tool in which abrasive grains are fixed to the outer peripheral surface of the wire by plating. Background technique [0002] Conventionally, wafers for photovoltaic power generation, semiconductor elements, LED elements, or their growth substrates have been diced (including dicing) using a dedicated dicing machine such as a multi-wire saw capable of obtaining multiple wafers at a time. The use of abrasive wire tools in which abrasive grains such as diamond grains are fixed on the outer peripheral surface is increasingly used for such dedicated cutting machines. In this abrasive-grain-attached wire tool, the following methods are known as methods for fixing abrasive grains (diamond grains, etc.), and each has advantages and disadvantages as follows. [0003] (a) Regarding the method of fixing abrasive grains with resin, a mixture of resin and abra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D11/00B24B27/06B24D3/00B24D3/06
CPCB24D3/00B24B27/0633B24D11/00B24B27/06B24D3/06B28D5/045
Inventor 中岛秀俊盐山胜德高岩昭博田中一彰铃木理潮田贵大
Owner RIKEN CORUNDUM
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