Geothermal heat dissipation integrated board and installation method
An integrated board and geothermal technology, applied in the field of decorative materials, can solve the problems of inconvenient geothermal pipeline daily maintenance and care, inconvenient geothermal pipeline heat dissipation, and economic losses of residents, and achieve the effects of uniform heat dissipation, light weight, and easy maintenance
Active Publication Date: 2017-07-04
闫长埝
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- Application Information
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Problems solved by technology
[0002] At present, geothermal heat mainly relies on pre-buried geothermal pipes, followed by cement pouring. After a long time, geothermal pipes are damaged and cannot be repaired, causing great economic losses to residents, and it is not convenient for daily maintenance and care of geothermal pipes. The main thing is that it is inconvenient to use this geothermal laying method to dissipate heat from geothermal pipelines, or the heat dissipation is uneven, resulting in energy loss, which is not environmentally friendly and energy-saving
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[0028] The present invention will be further described below in conjunction with drawings and implementation.
[0029] Such as figure 1 As shown, the integrated board includes at least two substrates and an adjustment seat. In this embodiment, there are four substrates, each of which has a size of 330mm×330mm, and nine adjustment seats. The adjustment seat is passed between two adjacent substrates. Fixed connection.
[0030] Such as Figure 4 As shown, the base plate includes a panel 1 and fixing pins 2 , the panel 1 is a metal square plate, and the fixing pins 2 are installed at four corners of the panel 1 .
[0031] Such as figure 2 As shown, the adjustment seat includes an adjustment rod 3 , an adjustment head 4 , a sealing ring 5 and a fixing bolt 6 .
[0032] Such as image 3 As shown, the adjusting head 4 is provided with fixing holes 7. In this embodiment, there are four fixing holes 7. The adjusting rod 3 is provided with external threads. The adjusting head 4 is...
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The invention discloses a floor heating radiating integration plate, which comprises at least two basic plates and at least one adjusting seat. The mounting method comprises the steps: a wall at one side is selected as a start point of the integration plate; a fixed pin of one basic plate is inserted into a fixed hole of an adjusting head; fixed pins of adjacent basic plates are inserted into other fixed holes of the adjusting head in sequence; the heights of the adjusting seats are fixed; other basic plates are mutually mounted and connected into a whole by the adjusting seats in sequence; the basic plates which are adjacent to the wall need to preserve an expansion joint away from the wall; a waterproof layer is laid; and laying ends. The invention has the beneficial effects of facilitating the uniform heat radiation of a floor heating pipeline; facilitating the maintenance of the floor heating pipeline; reducing the load of a building; realizing repeated usage; effectively supporting a floor; and prolonging the service life of the floor. The sound insulation effect is strong; the installation is quick; the manufacturing cost is low; and no pollution is caused.
Description
technical field [0001] The invention belongs to the technical field of decorative materials, and in particular relates to a geothermal heat dissipation integrated board and an installation method. Background technique [0002] At present, geothermal heat mainly relies on pre-buried geothermal pipes, followed by cement pouring. After a long time, geothermal pipes are damaged and cannot be repaired, causing great economic losses to residents, and it is not convenient for daily maintenance and care of geothermal pipes. The main thing is that this geothermal laying method is not convenient for geothermal pipelines to dissipate heat, or the heat dissipation is uneven, energy is lost, and it is not environmentally friendly and energy-saving. Contents of the invention [0003] Aiming at the deficiencies of the prior art, the present invention provides a geothermal heat dissipation integrated board and an installation method. [0004] The present invention is achieved in this way...
Claims
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IPC IPC(8): E04F15/02F24D3/16
Inventor 闫长埝
Owner 闫长埝