Repairing and regeneration method for transparent conductive film and transparent conductive laminating body
A technology of transparent conductive film and transparent conductive layer, applied in the direction of conductive layer on insulating carrier, etc., can solve problems such as difficult to repair film defects
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Embodiment 1
[0255] 100 parts of poly(3,4-ethylenedioxythiophene) polystyrenesulfonic acid (manufactured by Heraeus, Clevios PH1000), 14 parts of alkoxysilane oligomer (manufactured by Fuso Chemical Industry Co., Ltd., N-POS) 37 parts of 3-hydroxypropionitrile (manufactured by Tokyo Chemical Industry Co., Ltd., δD=17.2, δH=18.8, δP=17.6), 19 parts of 1% nitric acid, 255 parts of ethanol (manufactured by Nacalai Tesque, boiling point 78.4° C.), ion exchange 45 parts of water were mixed to obtain a composition for forming a transparent conductive film. Using the obtained composition for forming a transparent conductive film, a transparent conductive film was formed by the method described in 2-1. The film thickness of the obtained transparent conductive film was 0.05 μm.
[0256] In the transparent conductive film, as film defects, chips and foreign substances existing on the film surface were confirmed. The maximum length of the film defect portion was 20 μm. On this transparent conducti...
Embodiment 2
[0259] 80 parts of poly(3,4-ethylenedioxythiophene) polystyrenesulfonic acid (manufactured by Heraeus, Clevios PH1000), silver nanowires (manufactured by Starlight PMC, T-YP808, aspect ratio 230, solid content 1.0%) 50 parts, polyester resin (manufactured by Nagase ChemteX Co., Ltd., Gabusen ES-210, solid content 25%) 42 parts, pyrazole (manufactured by Tokyo Chemical Industry Co., Ltd., δD=20.2, δH=10.4, δP=12.4) 37 parts 190 parts of ethanol (manufactured by Nacalai Tesque, boiling point 78.4° C.), 10 parts of 2-propanol (manufactured by Sagane Bussan, boiling point 82.5° C.), and 100 parts of ion-exchanged water were mixed to obtain a composition for forming a transparent conductive film. Using the obtained composition for forming a transparent conductive film, a transparent conductive film was formed by the method described in 2-1. The film thickness of the transparent conductive film was 0.3 μm.
[0260]In the transparent conductive film, as film defects, defects existin...
Embodiment 3
[0263] 100 parts of poly(3,4-ethylenedioxythiophene) polystyrenesulfonic acid (manufactured by Heraeus, Clevios PH1000), polyester resin (manufactured by Nagase ChemteX, Gabusen ES-210, solid content 25%) 33 Parts, 255 parts of ethanol (manufactured by Nacalai Tesque, boiling point 78.4° C.), 45 parts of ion-exchanged water, polyether ester-modified hydroxyl-containing polydimethylsiloxane (manufactured by BYK Chemical Japan, BYK-375, no 25% of volatile components) were mixed in 0.5 parts to obtain a composition for forming a transparent conductive film. Using the obtained composition for forming a transparent conductive film, a transparent conductive film was formed by the method described in 2-1. The film thickness of the transparent conductive film was 0.5 μm.
[0264] In the transparent conductive film, foreign substances and defects present in the film or at the interface between the film and the base material were confirmed as film defects. The maximum length of the fi...
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