Camera module set support and camera module set with same

Abstract

The invention discloses a camera module set support and a camera module set with the same. The camera module set support comprises a support body and a side wall portion; a through hole which passes through the support body along the thickness direction of the support body is formed in the support body; the side wall portion is arranged on the support body and is ring-shaped and surrounds the through hole; an inner mounting space and an external mounting space are defined between the support body and the side wall portion, wherein the inner mounting space is located at the inner side of the side wall part and is communicated with the through hole and is used for mounting an image sensing chip, and the external mounting space is located at the outer side of the side wall portion and is used for mounting an electronic element. The camera module set support of the invention has the inner mounting space and the external mounting space, and the image sensing chip is mounted in the inner mounting space, and the electronic element is mounted in the external mounting space, and therefore, influence on imaging which is caused by a situation in which dust and debris enter an image sensing region of the image sensing chip can be eliminated.

Description

technical field [0001] The invention relates to the field of imaging technology, in particular to a camera module bracket and a camera module with the same. Background technique [0002] The image sensor chip and electronic components in the traditional camera module are all arranged on the circuit board and accommodated in the inner cavity of the camera module bracket. Since the electronic components are arranged around the image sensor chip, glue is drawn on the production line. When the rubber needle hits the electronic components, there will be a risk of hitting the electronic components. Once it hits the electronic components, a lot of debris will be generated, which is difficult to eliminate and will affect the image quality in severe cases. Moreover, particles and impurities are easily hidden between the electronic components and the capacitive conductive sheet on the circuit board. When the camera is shaken, the particles and impurities may fall into the image sensin...

AI Technical Summary

Problems solved by technology

[0002] The image sensor chip and electronic components in the traditional camera module are all arranged on the circuit board and accommodated in the inner cavity of the camera module bracket. Since the electronic components are arranged around the image sensor chip, glue is drawn on the production line. When the rubber needle hits the electronic components, there will be a risk of hitting the electronic components. Once it hits the electronic components, a lot of debris will be generated, which is difficult to eliminate and will affect the image quality in severe cases.

Moreover, particles and impurities are easy to hide between the electronic components and the capacitive conductive sheet on the circuit board. When the camera is shaken, the particles and impurities may fall into the image sensing area of ​​the image sensor chip and seriously affect the imaging effect.

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