Method and apparatus to reduce PA/device temperature by switching the antennas on a device

Abstract

Methods, systems, and devices are described for thermal management of a wireless communication device. The described techniques may be used, for example, to monitor an operating temperature of the device to determine if the operating temperature has exceeded a threshold value. Other aspects may provide for monitoring of a PA temperature, a transmission power level, and / or input from one or more additional sensors associated with the wireless communication device. Based on any of the above inputs, alone or in combination, an operating temperature of the wireless communication device may be determined When the temperature exceeds the threshold value, a transmission antenna can be switched from a first antenna to a second antenna. Additional aspects may provide for reduction of the transmission power level in response to the operating temperature exceeding the predetermined threshold value.

Description

[0001] cross reference [0002] This application is for the patent right of the US patent application with serial number 14148175 filed on January 6, 2014, entitled "Method and Apparatus to Reduce PA / Device Temperature by Switching the Antennas on a Device", authored by Sandhu and others , the U.S. patent application claims "Method and Apparatus to Reduce PA / Device Temperature by Switching the Antennas on a Device," filed January 15, 2013, by Sandhu et al., Serial No. 61 / 752,875 The priority of the U.S. Provisional Patent Application, which is assigned to the assignee, is expressly incorporated herein by reference. technical field [0003] The following relates generally to wireless communications and, more specifically, to reducing a mobile device's power amplifier (PA) and / or device temperature by switching antennas on the mobile device. Background technique [0004] The following relates generally to wireless communications and, more specifically, to reducing power ampli...

AI Technical Summary

Problems solved by technology

Excessive heat associated with the device may result in diminished operating performance or premature aging of electronic components within the device

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