Laminating method for blind slot plate
A blind slot and press technology, which is applied in the field of circuit board manufacturing, can solve the problems of difficulty in mass production, the problem that the edge of the blind slot cannot effectively control the overflow of glue, and the processing is cumbersome, etc., and achieves the effect of improving production efficiency.
Active Publication Date: 2015-09-23
SHENZHEN XUNJIEXING TECH CORP LTD
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Problems solved by technology
[0002] In the PCB industry, non-flowing PP is required when making opening windows for blind slot boards and rigid-flex boards. However, the problem of the amount of glue overflowing during the lamination process of non-flowing PP has always been a difficult point in the industry and cannot be completely solved. ills
The existing technology has the following disadvantages: (1) The processing is cumbersome, and the glue overflow problem cannot be effectively controlled at the edge of the blind groove; (2) The processing cost is high, and mass production is difficult
Method used
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[0012] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but the present invention can be implemented in many different ways defined and covered by the claims.
[0013] Please provide Figure 1 to Figure 2 , provides a method for pressing a blind slot plate, comprising: step 1, placing a rubber-resisting buffer film 2 on the upper and lower sides of a blind slot plate 1 to obtain a first layer, the rubber-resisting buffer film consists of sequentially The first release film 3, the epoxy resin glue 4 and the second release film 5 compounded from top to bottom; step 2, use a press to press the first layer to make the two adhesive buffer films After the epoxy resin glue 4 is melted, the blind groove 6 on the blind groove plate 1 is filled and cured to achieve the purpose of resisting glue, so that there is no glue trace overflowing in the blind groove; step 3, take out the first layer after lamination Objects,...
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The invention provides a laminating method for a blind slot plate. The method comprises: step 1, respectively placing a glue resisting buffer film on each of the upper and lower sides of the blind slot plate so as to obtain a first layered substance, wherein each of the glue resisting buffer films comprises a first release film, epoxy resin glue and a second release film which are sequentially compounded from top to bottom; step 2, laminating the first layered substances by using a press, wherein epoxy resin glue in the two glue resisting buffer films is melted to fill a blind slot in the blind slot plate and is cured and formed to realize the purpose of resisting glue, and no glue overflows out of the blind slot; and step 3, taking out the laminated first layered substances and tearing off the glue resisting buffer films on the upper and lower sides of the blind slot plate. According to the method provided by the invention, the glue overflowing amount of high-fluidity PP and non-flowing PP can be effectively stopped and the production efficiency can be effectively enhanced.
Description
technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a blind slot board pressing method. Background technique [0002] In the PCB industry, non-flowing PP is required when making opening windows for blind slot boards and rigid-flex boards. However, the problem of the amount of glue overflowing during the lamination process of non-flowing PP has always been a difficult point in the industry and cannot be completely solved. ills. The existing technology has the following disadvantages: (1) the processing is cumbersome, and the glue overflow problem cannot be effectively controlled at the edge of the blind groove; (2) the processing cost is high, and mass production is difficult. Contents of the invention [0003] The invention provides a method for pressing blind groove plates that can effectively prevent glue overflow and improve production efficiency. [0004] In order to solve the above problems, as one aspect of the...
Claims
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IPC IPC(8): B32B37/10
CPCB32B37/10
Inventor 马卓刘洋洋王一雄
Owner SHENZHEN XUNJIEXING TECH CORP LTD