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Open mouth plastic package

A technology of opening mouth and plastics, which is applied in the field of opening mouth plastic packaging, and achieves the effect of cheap process

Active Publication Date: 2019-02-01
MICROCHIP TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] According to various embodiments, a spring loaded solution is provided to solve all those problems discussed above and make the process of manufacturing the environment sensing device cheaper

Method used

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  • Open mouth plastic package
  • Open mouth plastic package
  • Open mouth plastic package

Examples

Experimental program
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Embodiment Construction

[0011] Figure 1A and 1B A cross-sectional side view and a top view of an open cavity plastic IC package 10 made by the process of the present invention are illustrated. The open cavity plastic IC package 10 has a die 140 positioned on a leadframe 130 . Bond wires 135 extend from die 140 to leadframe 130 . The IC package 10 is covered with a plastic encapsulant 145 that provides a sensor port or open cavity 147 to make the sensors on the die 140 accessible to the ambient conditions in which the IC package 10 may be placed.

[0012] Figure 1C Description Die 105 Figure 1A and 1B Cross-sectional side view of IC package 10. During the manufacturing process, an encapsulant in the form of molding compound is pumped into the mold to cover the interconnects or bond lines. The mold 105 comprises two half-shell molds; an upper mold 110 of the mold and a lower mold 120 of the mold. The upper die 110 of the die has pins 160 that contact the upper surface of the die 140 when the...

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Abstract

A method for manufacturing an open-mouth integrated circuit package, the method comprising: placing a wire bonded integrated circuit in a mold; forcing the pin to contact the wire bonded integrated circuit by applying a force between the pin and the mold. a die of circuitry; injecting plastic into the mold; allowing the plastic to solidify around the integrated circuit to form a package having an open cavity defined by the pins; and removing the opening from the mold Oral body integrated circuit packaging. A mold for forming a package for an integrated circuit sensor device, comprising: a lower mold for supporting an integrated circuit die; an upper mold operable to be placed on top of the lower mold to form an Injecting plastic material thereinto form the cavity of the package, wherein the upper die of the mold includes a spring-loaded pin arrangement including a sensor area covering the integrated circuit die and when injected The plastic material provides a cover for the opening.

Description

[0001] priority claim [0002] This utility application claims priority to US Provisional Application No. 61 / 755,889, filed January 23, 2013. technical field [0003] The present invention relates to a method for making an open cavity plastic package for an integrated circuit (IC), and in particular, the present invention relates to a method of using a lid over an IC die during the encapsulation process to provide a package with an open cavity. Plastic encapsulation to allow the device to function as a sensing device. Background technique [0004] Integrated circuits (ICs) may contain sensors for various reasons. For example, an IC may include a moisture sensitive sensor to detect liquid or humidity. A manufacturer can include a moisture sensitive sensor to determine if an IC has been damaged by immersion in water, so that it knows whether a customer returning an IC is entitled to have it replaced under warranty. Other ICs include sensors that are a functional part of th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56B29C45/14
CPCH01L2224/48091H01L2224/48247H01L2924/1815H01L2224/45144H01L21/565H01L23/564H01L2924/00014H01L2924/00H01L21/67121B29C45/2628B29L2031/3481B81B7/0058
Inventor J·D·费尔南德斯S·吉蒂菲尼加塔N·亚穆普特宗S·莱尔特阿纳普雷查V·马伊库塔旺
Owner MICROCHIP TECH INC