Printed circuit board and its preparation method

Abstract

The invention relates to a method for preparing a printed circuit board, which includes inner layer manufacturing, outer layer manufacturing, hole metallization, green oil, solder paste printing, and reflow soldering, wherein: the hole metallization step is followed by the printing Via holes are obtained on the circuit board, and the via holes are divided into common via holes and multifunctional via holes; in the green oil step, the area corresponding to the multifunctional via holes on the screen for green oil printing is not opened ; In the step of printing solder paste, the area on the stencil for printing solder paste corresponding to the multi-functional via hole is the window area. The present invention innovatively utilizes via holes on the circuit board where test points need to be laid out, and carries out special process design so that it has complete test point functions, so that the via holes have dual functions of both through holes and test points.

Description

technical field [0001] The invention relates to the technical field of printed circuits, in particular to a printed circuit board and a preparation method thereof. Background technique [0002] In the current PCB circuit design, the via hole plays the role of connecting the inner and outer layers of the circuit; and the test point (the real pad on the outer layer) is the outer layer connection test function, and the two can not be compatible with the design (such as figure 1 shown). [0003] With the rapid development of the electronics industry, the boards are becoming more and more complex, and the layout of the test points on the board is becoming more and more difficult. Basically, there is not enough space for the PCB board to design test points. There are test points that cannot be laid out and can only be Sacrificing and reducing test point design; this will lead to some circuit functions and device reliability cannot be tested because there is no test point design; ...

AI Technical Summary

Problems solved by technology

[0002] In the current PCB circuit design, the via hole plays the role of connecting the inner and outer layers of the circuit; while the test point (the real pad on the outer layer) is used for the outer layer connection test, and the two cannot be compatible with the design (such as figure 1 shown)

[0003] With the rapid development of the electronics industry, the single board is becoming more and more complex, and the test point layout of the single board is becoming more and more difficult. Basically, there is not enough space for the PCB board to do test point design; Sacrifice the design of test points; this will cause some circuit functions and device reliability to be tested without test point design; there are hidden dangers in quality and reliability

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