Printed circuit board and preparation method thereof
A printed circuit board, multi-functional technology, applied in the directions of printed circuits, printed circuit components, circuit inspection/identification, etc., can solve the problems of inability to layout test points, difficult layout of single-board test points, and insufficient PCB boards. Achieve the effect of improving test accuracy and test life, improving test coverage, and improving product quality
Active Publication Date: 2015-11-04
GUANGDONG VTRON TECH CO LTD
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AI Technical Summary
Problems solved by technology
[0002] In the current PCB circuit design, the via hole plays the role of connecting the inner and outer layers; while the test point (the solid pad on the outer layer) is used for the outer layer connection test, and the two cannot be compatible with the design (such as figure 1 shown)
[0003] With the rapid development of the electronics industry, the single board is becoming more and more complex, and the test point layout of the single board is becoming more and more difficult. Basically, there is not enough space for the PCB board to do test point design; Sacrifice the design of test points; this will cause some circuit functions and device reliability to be tested without test point design; there are hidden dangers in quality and reliability
Method used
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Embodiment Construction
[0025] The present application will be further elaborated below by way of examples.
[0026] A method for preparing a printed circuit board, comprising inner layer manufacturing, outer layer manufacturing, hole metallization, green oil, solder paste printing, and reflow soldering, wherein:
[0027] After the hole metallization step, via holes are obtained on the printed circuit board, and the via holes are divided into common via holes and multifunctional via holes;
[0028] In the green oil step, the area corresponding to the multifunctional via hole on the screen for green oil printing is not opened with windows;
[0029] In the solder paste printing step, the area on the stencil used for solder paste printing corresponding to the multifunctional via hole is a window area.
[0030] The number of the multifunctional via holes accounts for 30% of the total amount of the via holes.
[0031] First, select the via hole that needs to be designed for compatibility. In the green o...
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The invention relates to a preparation method of a printed circuit board, which comprises the steps of inner layer preparation, outer layer preparation, hole metallization, green oil, solder paste printing and reflow soldering. According to the invention, via holes are acquired on the printed circuit board after the step of hole metallization, and the via holes are divided into ordinary via holes and multifunctional via holes; in the step of the green oil, areas corresponding to the multifunctional via holes on a silk screen printed by the green oil are not windowed; and in the step of solder paste printing, areas corresponding to the multifunctional via holes on a steel mesh printed by the solder paste are windowed areas. According to the invention, a special process design is carried out on a circuit board on which test points are required to be arranged by using the via holes so as to enable the via holes to have complete test point functions, thereby achieving a purpose that the via holes have double functions of through holes and test points.
Description
technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a printed circuit board and a preparation method thereof. Background technique [0002] In the current PCB circuit design, the via hole plays the role of connecting the inner and outer layers; while the test point (the solid pad on the outer layer) is used for the outer layer connection test, and the two cannot be compatible with the design (such as figure 1 shown). [0003] With the rapid development of the electronics industry, the single board is becoming more and more complex, and the test point layout of the single board is becoming more and more difficult. Basically, there is not enough space for the PCB board to do test point design; Sacrifice the design of test points; this will cause some circuit functions and device reliability to be tested without test point design; there are hidden dangers in quality and reliability. [0004] Therefore, it is urgent t...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K1/02H05K1/11
CPCH05K1/0268H05K1/116
Inventor 黄海兵
Owner GUANGDONG VTRON TECH CO LTD