A kind of carbon nanotube flexible photosensitive device and its preparation method
A technology of photosensitive devices and carbon nanotubes, which is applied in the direction of nanotechnology, nanotechnology, semiconductor devices, etc., can solve the problems of difficult removal of metallic carbon nanotubes, complicated process preparation process, large manufacturing process deviation, etc., to achieve photosensitive performance and Excellent electrical properties, excellent photosensitivity, and low cost
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[0051] The preparation method of the carbon nanotube flexible photosensitive device of the present invention, as shown in Figure 2, mainly comprises the following steps:
[0052] 1) On a silicon wafer substrate 9 with a thickness of 300-600 um, a silicon dioxide layer 8 of 200-300 nm is thermally oxidized and grown;
[0053] 2) Spin-coat a layer of 20-30 μm polyimide (PI) or polydimethylsiloxane (PDMS) polymer film on the silicon substrate 9 growing the silicon oxide layer 8 as the flexible support layer 1;
[0054] 3) Magnetron sputtering or electron beam evaporation of a silicon dioxide film with a thickness of 10-20 nm on the silicon wafer substrate prepared with a flexible support layer as the flexible buffer layer 2;
[0055] 4) On the silicon dioxide flexible buffer layer, the square resistance is 6-10Ω / cm prepared by magnetron sputtering or electron beam evaporation 2 ITO, or spin-coating a silver nanowire network with a particle size of 50-100nm and a length of 15-20u...
Embodiment 1
[0063] This embodiment is used to prepare carbon nanotube flexible photosensitive devices, and the specific process flow is as follows:
[0064] 1) On a silicon wafer substrate 9 with a thickness of 300-600 um, a silicon dioxide layer 8 of 200-300 nm is thermally oxidized and grown;
[0065] 2) On the silicon substrate 9 on which the silicon oxide layer 8 is grown, spin-coat a layer of 20-30 μm polyimide (PI) film as the flexible supporting layer 1;
[0066] 3) Magnetron sputtering or electron beam evaporation of a silicon dioxide film with a thickness of 10-20 nm on the silicon wafer substrate prepared with a flexible support layer as the flexible buffer layer 2;
[0067] 4) The square resistance of magnetron sputtering on the silicon dioxide flexible buffer layer is 6-10Ω / cm 2 The ITO used as the flexible back gate electrode layer 3;
[0068] 5) A layer of 10-20nm thick metal oxide HfO is grown on the substrate with the prepared flexible back gate electrode by low-temperat...
Embodiment 2
[0074] This embodiment prepares a carbon nanotube photosensitive device, which is basically the same as Embodiment 1, except that step 4) adopts the technology of spin-coating silver nanowire network to prepare flexible back gate electrode layer 3, whose particle size is 50-100nm, and the length is 15-20um, the silver nanowire network has better conductivity, and it has better flexibility than ITO.
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