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Micro-distance FPC board automatic detection device

An automatic detection device, detection device technology, applied in the direction of measuring device casing, electronic circuit testing, etc., can solve the problems of large eye damage, low efficiency, long time, etc.

Active Publication Date: 2015-12-09
OHNISHI ELECTRONICS (KUNSHAN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method requires a very high alignment accuracy between the product and the adapter substrate after placement. In the existing technology, after the CCD is used to enlarge it on the display screen, the adapter substrate is manually fine-tuned to achieve precise docking with the golden finger. It takes a lot of time to align, and if the time is long, it will cause great damage to the operator's eyes, and it is necessary to manually open the detection device for detection, which is inefficient

Method used

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  • Micro-distance FPC board automatic detection device
  • Micro-distance FPC board automatic detection device

Examples

Experimental program
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Embodiment

[0029] Please refer to figure 1 , the present embodiment is a micro-distance FPC board automatic detection device 100, which includes a cabinet 1, a rotary transmission module 2 fixed on the cabinet 1, several lower jig devices 3 fixed on the rotary transmission module 2, a fixed The pressing detection device 4 on the cabinet 1 , the automatic unloading device 5 fixed on the cabinet 1 , and the unloading conveying device 6 fixed on the cabinet 1 .

[0030] Please refer to figure 1 , figure 2 , image 3 The rotary transmission module 2 includes a first driving device 21 fixed inside the cabinet 1, a first transmission gear 22 fixed on the rotating shaft of the first driving device 21, a transmission module 23 located on the table of the cabinet 1, and a transmission module 23 fixed on the table of the cabinet 1. The second transmission gear 24 on the horizontal rotation shaft in the transmission module 23 and connected with the first transmission gear 22 through a belt or c...

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Abstract

A micro-distance FPC board automatic detection device disclosed by the present invention comprises a cabinet, a rotary transmission module fixed on the cabinet, a plurality of lower jig devices fixed on the rotary transmission module, a press fitting detection device fixed on the cabinet, an automatic discharging device and a discharging conveying device. The rotary transmission module comprises a first driving device fixed inside the cabinet, a transmission module connected with the first driving device, and a circular rotating and supporting plate fixed on the transmission module. The lower jig devices are evenly distributed on the rotating and supporting plate in an equal angle manner, and the press fitting detection device, the automatic discharging device and the discharging conveying device are arranged around an outer edge of the rotary transmission module. According to the present invention, the plurality of same lower jig devices are fixed on the circular rotary transmission module which rotates circularly, so that a feeding, press fitting detection and discharging integrated material transmission function is realized within a smaller space range.

Description

【Technical field】 [0001] The invention belongs to the technical field of precision electronic detection, in particular to a micro-distance FPC board automatic detection device. 【Background technique】 [0002] With the rapid development of information products such as mobile phones, PADs, and smart instruments, the thickness requirements of products are becoming thinner and lighter, and the weight requirements are becoming lighter and lighter. Correspondingly, there are more and more FPC boards inside, and the width and pitch of golden fingers are getting more and more. small. According to the needs of market customers, the pitch of the gold fingers on FPC products is only 0.14mm, and the gap between the gold fingers is only 0.07mm. If the linear probe is directly used for testing, the product will be crushed, so the transfer substrate can only be used as an intermediate connection bridge, that is, the gold finger of the line is bonded to the gold finger. This method requir...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28G01R1/04
Inventor 章维张强李国娟
Owner OHNISHI ELECTRONICS (KUNSHAN) CO LTD
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