Stripper composition for removing photoresist and method of stripping photoresist using the same

A technology of composition and release agent, applied in optics, opto-mechanical equipment, photosensitive material processing, etc., can solve problems such as reduced process economy and efficiency, environmental or process problems, etc.

A technology of composition and release agent, applied in optics, opto-mechanical equipment, photosensitive material processing, etc., can solve problems such as reduced process economy and efficiency, environmental or process problems, etc.

CN105143984BActive Publication Date: 2017-09-05LG CHEM LTD

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  • Stripper composition for removing photoresist and method of stripping photoresist using the same
  • Stripper composition for removing photoresist and method of stripping photoresist using the same
  • Stripper composition for removing photoresist and method of stripping photoresist using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0057] specific implementation plan

[0058] Hereinafter, the actions and effects of the present invention will be explained with reference to Examples and Comparative Examples. It should be noted that the examples are only for illustrating the present invention, and the scope of the present invention is not limited thereto.

[0059] Preparation of stripper composition for removing photoresist

[0060] According to the composition of Table 2 below, according to Examples 1 to 7 and Comparative Examples 1 to 3, the components were mixed to prepare a stripper composition for removing a photoresist.

[0061] [Table 2]

[0062]

[0063]

[0064] *LGA: imidazolyl-4-ethanol (IME)

[0065] *AEE: (2-aminoethoxy)-1-ethanol

[0066] *DMAC: Dimethylacetamide

[0067] *NMF: N-methylformamide

[0068] *DCA: N,N’-Diethylformamide

[0069] *DMF: N,N'-Dimethylformamide

[0070] *BDG: Diethylene glycol monobutyl ether

[0071] *MDG: Diethylene glycol monomethyl ether

[0072] *...

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Abstract

The present invention relates to a photoresist-removing stripper composition which does not comprise N-methylformamide, N, N'-dimethylcarboxamide, or the like, showing reproductive toxicity, but is capable of showing excellent stripping capacity and rinsing capacity and is capable of minimizing time-dependent deterioration of physical properties; and a method for stripping a photoresist using the composition. The photoresist-removing stripper composition comprises: one or more types of amine compounds; N, N'-diethylcarboxamide; and a protic organic solvent of alkyleneglycol monoalkylether or alkyleneglycol.

Description

technical field [0001] The present invention relates to a stripper composition for removing a photoresist and a method for stripping a photoresist using the same, the stripper composition for removing a photoresist does not contain N having reproductive toxicity -Methylformamide or N,N'-dimethylformamide, etc., can still exhibit excellent stripping performance and rinse performance and minimize performance degradation over time. Background technique [0002] The microcircuit process of liquid crystal displays or the manufacturing process of semiconductor integrated circuits includes many methods for forming the following various bottom films: conductive metal films such as aluminum, aluminum alloys, copper, copper alloys, molybdenum, molybdenum alloys, etc.; or silicon oxide films , silicon nitride film, acrylic insulating film and other insulating films, the photoresist is evenly coated on this base film, and it is selectively exposed and developed to form a photoresist pat...

Claims

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Application Information

Patent Timeline
05 Sep 2017
Publication
CN105143984B
IPC
G03F7/42; H01L21/027
CPC
G03F7/422
Inventors
郑倧哲; ζŽδΈœε‹‹