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Method, structure and device for bonding two substrates

A technology that combines two substrates, applied in bonding methods, adhesives, etc., can solve problems such as complex process flow, and achieve the effect of high efficiency and convenient operation.

Active Publication Date: 2018-02-06
SUZHOU TONGLI PHOTOELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of this method is that the process is complicated

Method used

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  • Method, structure and device for bonding two substrates
  • Method, structure and device for bonding two substrates
  • Method, structure and device for bonding two substrates

Examples

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Embodiment 1

[0027] Embodiment 1: Method, structure and device for combining two substrates

[0028] See attached figure 1 , attached Figure 4~7 As shown, a method, structure and device for combining two substrates, including a first substrate 1 and a second substrate 2, the combining method includes first forming a closed dam on one surface of the first substrate 1 3. The dam 3 is provided with an exhaust channel 4 and a liquid injection channel 5; then the second substrate 2 is stacked toward the dam 3 and the first substrate 1 to form a glue with the dam 3 as a frame Adhesive storage space; Next, inject adhesive into the adhesive storage space through the liquid injection channel 5 . The dam is formed by adhering a circle of double-sided adhesive tape on one surface of the first substrate 1 to form a closed dam. The method for injecting the adhesive into the adhesive storage space can use existing technologies, such as medical injection needles. Since the distance between the first...

Embodiment 2

[0029] Embodiment 2: Method, structure and device for combining two substrates

[0030] See attached figure 2 , attached Figure 4~7 As shown, the difference between this embodiment and the first embodiment is that a strip-shaped adhesive is coated on one surface of the first substrate 1 and cured to form a closed dam 3 . Then pre-embed the liquid injection pipe 6 and the exhaust pipe 7 on the dam 3 .

Embodiment 3

[0031] Embodiment 3: Method, structure and device for combining two substrates

[0032] See attached image 3 , attached Figure 4~7 As shown, the difference between this embodiment and the first embodiment is that a positioning block 13 is sandwiched between the first substrate 1 and the second substrate 2 .

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Abstract

A method, structure, and device for binding two substrates, comprising a first substrate and a second substrate. The binding method comprises: first forming, on a surface of the first substrate, a closed surrounding barrier provided with an air vent channel and a liquid injection channel; stacking, toward the surrounding barrier, the second substrate over the first substrate to form an adhesive storage space with the surrounding barrier as a frame of the adhesive storage space; and next, injecting, via the liquid injection channel, an adhesive into the adhesive storage space. The present invention forms a surrounding barrier between two substrates to form an adhesive storage space, and then charges, employing an injection method, an adhesive between the two substrates, thereby having advantages of convenient operation and a high efficiency.

Description

technical field [0001] The invention relates to a method, a structure and a device for combining two substrates, in particular to a method and a device for injecting adhesive into the middle of the two substrates to combine the two substrates. Background technique [0002] In the manufacture of electronic products, it is usually necessary to bond two substrates together by bonding. The invention patent application with the application number CN201310573093.2 discloses a method for combining two substrates, the method includes the following steps: applying a bonding agent to the first substrate, making the bonding agent partially hardening, applying a second substrate to the bonding agent, wherein the second substrate is applied to the bonding agent before the bonding agent is fully hardened. The disadvantage of this method is that the process flow is complicated. Contents of the invention [0003] The object of the present invention is to provide a method, structure and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J5/00
CPCC09J5/00
Inventor 赵春玲
Owner SUZHOU TONGLI PHOTOELECTRIC CO LTD