A method of pulse reverse electrodeposition thick tungsten coating

A pulse reversal, electrodeposition technology, applied in the field of surface treatment, can solve the problems of uneven surface, low electrodeposition efficiency, uneven coating distribution, etc., to achieve good flatness, increase electrodeposition efficiency, and improve electrodeposition rate Effect

Active Publication Date: 2017-10-31
NANJING UNIV OF INFORMATION SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Purpose of the invention: The present invention provides a method for pulse reverse electrodeposition thick tungsten coating to solve the problem of low electrodeposition efficiency, uneven coating distribution and uneven surface in the existing single pulse electrodeposition thick tungsten coating technology The problem

Method used

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  • A method of pulse reverse electrodeposition thick tungsten coating
  • A method of pulse reverse electrodeposition thick tungsten coating
  • A method of pulse reverse electrodeposition thick tungsten coating

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Experimental program
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Effect test

Embodiment 1

[0031] a. Pretreatment: Use wire cutting to cut low-activation steel plate and tungsten plate into sheet samples, and then use 240#, 500#, 800# sandpaper to polish, then use acetone to ultrasonically clean the surface of the anode and the substrate, and dry spare.

[0032] b. Molten salt preparation: Before the molten salt preparation, sodium tungstate and tungsten trioxide were dried at 250°C for 12 hours. Sodium tungstate and tungsten trioxide with a molar ratio of 3:1 are ground and mixed evenly, then put into a high-purity alumina crucible, heated to 850°C in a crucible resistance furnace, and kept warm for use.

[0033] c. Pulse reverse electrodeposition: connect the treated low-activation steel plate and tungsten plate through platinum wire and put them into molten salt until completely submerged. The low-activation steel plate is used as the cathode and the tungsten plate is used as the anode. Double anodes are used to place the anode and cathode in parallel. The elect...

Embodiment 2

[0040] a. Pretreatment: Use wire cutting to cut low-activation steel plate and tungsten plate into sheet samples, and then use 240#, 500#, 800# sandpaper to polish, then use acetone to ultrasonically clean the surface of the anode and the substrate, and dry spare.

[0041] b. Molten salt preparation: Before the molten salt preparation, sodium tungstate and tungsten trioxide were dried at 250°C for 12 hours. Sodium tungstate and tungsten trioxide with a molar ratio of 3:1 are ground and mixed evenly, then put into a high-purity alumina crucible, heated to 900°C in a crucible resistance furnace, and kept warm for use.

[0042]c. Pulse reverse electrodeposition: connect the treated low-activation steel plate and tungsten plate through platinum wire and put them into molten salt until completely submerged. The low-activation steel plate is used as the cathode and the tungsten plate is used as the anode. Double anodes are used to place the anode and cathode in parallel. The electr...

Embodiment 3

[0048] a. Pretreatment: Use wire cutting to cut low-activation steel plate and tungsten plate into sheet samples, and then use 240#, 500#, 800# sandpaper to polish, then use acetone to ultrasonically clean the surface of the anode and the substrate, and dry spare.

[0049] b. Molten salt preparation: Before the molten salt preparation, sodium tungstate and tungsten trioxide were dried at 250°C for 12 hours. Sodium tungstate and tungsten trioxide with a molar ratio of 3:1 are ground and mixed evenly, then put into a high-purity alumina crucible, heated to 900°C in a crucible resistance furnace, and kept warm for use.

[0050] c. Pulse reverse electrodeposition: connect the treated low-activation steel plate and tungsten plate through platinum wire and put them into molten salt until completely submerged. The low-activation steel plate is used as the cathode and the tungsten plate is used as the anode. Double anodes are used to place the anode and cathode in parallel. The elect...

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Abstract

The invention discloses a method for pulse reverse electrodeposition thick tungsten coating, which comprises the following steps: pretreatment; molten salt configuration; pulse reverse electrodeposition; ultrasonic cleaning; the invention does not change the tungsten coating while improving the efficiency of electrodeposition The surface quality of the coating, the surface roughness of the tungsten coating is controlled, and the prepared thick tungsten coating has a compact surface structure, good flatness, and no cracks; the pulse reverse technology is adopted, compared with the single-phase pulse electrodeposition technology , the highly inhomogeneous anode current distribution caused by the reverse current will cause the protruding part of the coating to be strongly dissolved and leveled, so that the metal ion concentration on the cathode surface will rise rapidly and reduce the concentration polarization. Therefore, the tungsten coating prepared by the present invention The surface is smoother and the electrodeposition efficiency is increased. The thickness of the tungsten coating obtained by pulsed reverse electrodeposition for 10 hours reached 220 μm, and the surface roughness was 6.673 μm. The pulsed reverse electrodeposition technology did not reduce the surface quality of the coating while increasing the electrodeposition rate.

Description

technical field [0001] The invention belongs to the technical field of surface treatment, in particular to a method for pulse reverse electrodeposition thick tungsten coating. Background technique [0002] Metal tungsten has very high melting point, high strength, small electron spillover work, good chemical stability and high temperature conductivity and other good physical and chemical properties, so tungsten has a good role in the electronics industry and aerospace technology. Application prospects, such as extraction in X-ray machines, heat shielding materials, semiconductor substrates for micro-electromechanical systems, etc. However, metal tungsten has poor processing performance, is very brittle at room temperature, and is difficult to machine at room temperature, and the reserves of tungsten are small and expensive. Forming a metal tungsten coating on the surface of components made of ordinary materials can not only reduce processing difficulties, but also save raw ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/66C25D5/18
Inventor 江凡邵绍峰吴红艳
Owner NANJING UNIV OF INFORMATION SCI & TECH
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