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Splicing method for PCB of different lamination structures

A laminated structure, PCB board technology, applied in the direction of multilayer circuit manufacturing, printed circuit manufacturing, electrical components, etc., can solve problems such as limitations

Active Publication Date: 2015-12-30
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Based on this, the purpose of the present invention is to overcome the defects of the prior art and provide a method for merging and manufacturing PCB boards with different laminated structures, which can solve the problem that the laminated structures limit the merging, and can combine PCBs with different laminated structures. PCB boards with layer structure are assembled and manufactured, thereby improving production efficiency and material utilization

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] This embodiment is a method for merging PCB boards with different stacked structures, wherein the PCB board includes a type a board whose stacked structure cannot be changed, and a type c board that does not require the stacked structure, and the stacked structure consists of three The sub-boards are superimposed (the number of sub-boards can be different according to the actual situation). The sub-board includes a core board and two prepregs. The two prepregs are respectively arranged on the upper surface and the lower surface of the core board. The sub-board has two Type, set as sub-board IT-180A, sub-board S1141, the method includes the following steps:

[0017] Combining type a board and type c board into one production group:

[0018] The structure of the type a board is: the upper, middle and lower layers are all IT-180A, the structure of the type c board is: the upper, middle and lower layers are all sub-boards S1141, but because the type c board has no requireme...

Embodiment 2

[0024] This embodiment is a method for merging PCB boards with different stacked structures, wherein the PCB board includes a type a board whose stacked structure cannot be changed, and a type c board that does not require the stacked structure, and the stacked structure consists of three The sub-boards are superimposed (the number of sub-boards can be different according to the actual situation). The sub-board includes a core board and two prepregs. The two prepregs are respectively arranged on the upper surface and the lower surface of the core board. The sub-board has three types: Type, set as sub-board IT-180A, sub-board S1141, and sub-board S0401, the method includes the following steps:

[0025] Combining type a board and type c board into one production group:

[0026] The structure of type a board is: the upper, middle and lower layers are the sub-board IT-180A, the structure of type c board is: the lower layer is the sub-board S0401, the middle layer is the sub-board ...

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Abstract

The invention discloses a splicing method for PCB of different lamination structures. The PCB comprises an a-type board whose lamination structure cannot be changed and a c-type board which has no requirements for the lamination structure, and the lamination structure is formed by laminating multiple sub-boards up and down. The splicing method comprises the following steps that the a-type board is spliced with the c-type board to form a production group, and the multiple sub-boards form a large substrate M in the lamination structure of the a-type board; the substrate M is segmented into small substrates m after laminating, boring and electro-coppering, and the size of the substrate m corresponds to that of the a-type or c-type board; and the substrates m are prepared into the a-type or c-type board after preparing of patters in the external layer, printing of solder masks, printing of characters, processing of the surface and processing of the profile. The problem that the lamination structure limits splicing is solved, the PCB of different lamination structures can be spliced, and the production efficiency and the material utilization rate are improved.

Description

technical field [0001] The invention relates to a method for combining and manufacturing PCB boards with different lamination structures. Background technique [0002] At present, in the production of PCB boards, most of them use a large board for production according to an order (that is, a single type), so if it is to produce a sample or a smaller board, it will be a waste of boards. With the continuous diversification of electronic products, there are more and more PCB boards with different functions and different types. Therefore, PCB boards began to try different order types for consolidation. Consolidation has enriched the types of PCB boards produced by enterprises and improved production efficiency. However, the conventional consolidation method in the industry is limited by the laminated structure. PCB boards with different laminated structures Could not merge. Contents of the invention [0003] Based on this, the purpose of the present invention is to overcome ...

Claims

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Application Information

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IPC IPC(8): H05K3/46
CPCH05K3/4611H05K3/4632H05K2201/09127
Inventor 林锡荣邓智河张德金
Owner GUANGZHOU FASTPRINT CIRCUIT TECH