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A method and device for bonding and strengthening a dielectric resonator

A dielectric resonator and bonding technology, which is applied to waveguide-type devices, circuits, electrical components, etc., can solve the problems of unreasonable use of cavity space, reduced tensile strength, poor stability, and poor reliability of dielectric resonators. The device has strong tensile strength, large contact surface and good reliability.

Active Publication Date: 2019-01-22
CHENGDUSCEON ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] (1) The glue is easy to fall off from the cavity, its stability and reliability are poor, and the tensile resistance of the dielectric resonator is reduced;
[0006] (2) The contact surface between the bracket of the dielectric resonator and the adhesive glue is small, and the space of the cavity is not used reasonably
[0007] (3) The assembly process is complicated, the cost is high, and the service life is not long

Method used

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  • A method and device for bonding and strengthening a dielectric resonator
  • A method and device for bonding and strengthening a dielectric resonator
  • A method and device for bonding and strengthening a dielectric resonator

Examples

Experimental program
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Embodiment 1

[0032] figure 1 , figure 2 , image 3 Shown, a kind of dielectric resonator adhesive reinforcement method of the present invention comprises the following steps:

[0033] A. Open positioning slot: open a positioning slot at the bottom of a metal cavity;

[0034] B. Open positioning holes: set three positioning holes around the positioning slot, and the center distance between the positioning slot and the positioning hole is less than the sum of the radii of the positioning slot and the positioning hole;

[0035] C. Apply glue: apply glue in the positioning groove and positioning hole;

[0036] D. Place the dielectric resonator in the positioning groove, and fix the dielectric resonator with the adhesive in the positioning hole.

[0037] This example implements a device for bonding and strengthening a dielectric resonator, including a box body 1 and four metal cavities 2, the metal cavities 2 are square, and a positioning groove 3 is provided at the bottom of each metal ca...

Embodiment 2

[0039] This example is basically the same as Example 1, the difference is:

[0040] Figure 4 As shown, the device of this example includes a box body 1, a metal cavity 2, the metal cavity 2 is circular, and a positioning groove 3 arranged at the bottom of the metal cavity 2, the positioning groove 3 is cylindrical, and its depth is 0.6mm, with a diameter of 3.6mm; and a threaded hole 4 is provided around the positioning groove 3, the diameter of the threaded hole 4 is 3mm, the depth is 3mm, and the center distance between the positioning groove 3 and the threaded hole 4 is less than 3.3mm; The depth of the positioning groove 3 has a certain margin under the support length of the dielectric resonator, so that the dielectric resonator and the positioning groove 3 can be easily matched without distance deviation. During implementation, the positioning groove 3 and the threaded hole 4 are firstly coated with adhesive, and then the dielectric resonator is placed in the positionin...

Embodiment 3

[0042] This example is basically the same as Example 1, the difference is:

[0043] The device of this example includes a box body 1 and four metal cavities 2, the metal cavities 2 are circular, and a positioning groove 3 is provided at the bottom of the metal cavity 2, the positioning groove 3 is cylindrical, and its depth is 0.4mm , with a diameter of 3.2mm; and two threaded holes 4 are provided around the positioning groove 3, the diameter of the threaded holes 4 is 1mm, the depth is 1mm, and the center distance between the positioning groove 3 and the threaded hole 4 is less than 2.1mm; positioning The depth of the slot 3 has a certain margin under the length of the bracket of the dielectric resonator, so that the dielectric resonator can be easily matched with the positioning slot 3 without distance shift. During implementation, the positioning groove 3 and the threaded hole 4 are firstly coated with adhesive, and then the dielectric resonator is placed in the positioning...

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Abstract

The invention belongs to the field of wireless communication, and discloses a method for bonding and reinforcing a medium resonator. The method comprises the following steps: A, arranging positioning grooves, i.e., arranging the positioning grooves at the bottom portions of metal cavities; B, arranging positioning holes, i.e., arranging the positioning holes at the peripheries in immediate vicinity of the positioning grooves, wherein the distance between each positioning groove and the center of each positioning hole is smaller than the sum of the radius of each positioning groove and the radius of each positioning hole; C, coating a bonding agent, i.e., coating the positioning grooves and the positioning holes with the bonding agent; and D, placing the medium resonator in the positioning holes, and fixing the medium resonator through the bonding agent in the positioning hole. The method is simple to use, easy to operate, low in cost and good in reliability.

Description

technical field [0001] The invention relates to the field of wireless communication, in particular to a method and device for bonding and strengthening a dielectric resonator. Background technique [0002] In modern mobile communication technology, microwave radio frequency devices are an important part. The dielectric cavity filter is widely used in various communication base stations due to its high quality factor, small size, high selectivity, low temperature drift, and high power capacity, and the key component of the dielectric cavity filter is the dielectric resonator. . [0003] The connection form of some dielectric resonators and the metal cavity is mainly to open a positioning hole of a certain depth at the bottom of the metal cavity and bond it with special glue. This method has the advantages of simplicity, easy operation and low cost, but has the disadvantage of poor reliability. [0004] Existing dielectric resonators have the following defects: [0005] (1)...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P11/00H01P1/207
Inventor 蔡文新唐波邹涌泉姚将锋
Owner CHENGDUSCEON ELECTRONICS