CTP full fitting technology
A fully-fitted and process technology, applied in the direction of instrument, electrical digital data processing, data processing input/output process, etc., can solve the problems of OCA overflow, difficult control of adhesion accuracy, OCA deviation, etc., to improve production. Efficiency, the effect of reducing rework and scrap
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[0017] Such as Figure 1 to Figure 3 As shown, the CTP full bonding process proposed by the present invention includes the following steps:
[0018] S1. Adhesive: Take the touch screen 1 and place it on the soft-to-hard platform and fix it, use the nozzle platform to suck the OCA glue 2 and stick the OCA glue 2 on the touch screen 1;
[0019] S2, heating: heating the touch screen 1 with the OCA glue 2 attached, the heating temperature is 35~45℃, and the heating time is 20-25s;
[0020] S3. Laminating: Take the protective glass 3, place it on a hard-to-hard platform and fix it, and glue the touch screen 1 with the OCA glue 2 and the protective glass 3 together.
[0021] Before step S1, it also includes the steps of cleaning; before the touch screen 1 is placed on the soft-to-hard platform, the touch screen 1 is cleaned; before the protective glass 3 is placed on the hard-to-hard equipment platform, the protective glass 3 is cleaned, and the touch screen 1 and The protective glass 3 ca...
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