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Shock-absorption circuit board assembly using contact sensor

A technology for contact sensors and circuit board components, applied in the direction of circuit layout, elastic/clamping devices, etc. on the support structure, which can solve the problem of affecting the wiring layout of the circuit board, affecting the mechanical strength of the circuit board, and unbalanced mechanical force on the circuit board, etc. question

Inactive Publication Date: 2016-01-27
邱林新
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, this installation mode first needs to open a through hole on the circuit board, which will affect the wiring layout of the circuit board itself, and will also affect the line stability of the traces around the through hole
Second, such vias will affect the mechanical strength of the board itself
More importantly, this installation mode will cause an imbalance in the mechanical force on the circuit board itself during the fastening process, resulting in the breakage of the circuits in each layer of the circuit board.

Method used

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  • Shock-absorption circuit board assembly using contact sensor
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Embodiment Construction

[0009] Combine below Figure 1-2 The present invention will be described in detail.

[0010] A shock-absorbing circuit board assembly using a touch sensor according to an embodiment includes a circuit board device 3 and a base fixing device. The circuit board device 3 includes a rectangular body part 30 and four corners of the rectangle respectively four fixing feet 31, the base fixing device includes a base 1 and four mounting frames 4 fixed on the base 1 and corresponding to the four fixing feet 31 respectively, the mounting frame 4 is provided with useful The slot 40 for the insertion of the fixing pin 31, the mounting frame 4 is provided with a biasing spring 83 at the inner part of the slot 40 close to the inner side of the body part 30 of the circuit board device 3 and can The inner clamping block 8 protruding into the slot 40, the upper side of the inner clamping block 8 is provided with a first stop protrusion 82 for cooperating with the chute in the mounting bracket ...

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PUM

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Abstract

A shock-absorption circuit board assembly using a contact sensor comprises a circuit board device (3) and a base fixing device, wherein the circuit board device (3) comprises a rectangular body part (30) and four fixed legs (31), the four fixed legs (31) are respectively arranged at corners of a rectangle, the base fixing device comprises a base (1) and four installation supports (4), the four installation supports (4) are fixed on the base (1) and are in respective correspondence to the four fixed legs (31), slots (40) are arranged in the installation supports (4) and are used for the fixed legs (31) to insert, and inner-side clamping blocks (8) are arranged at the inner side parts, close to a body part (30) of the circuit board device (3) and in the slots, of the installation supports, are biased by top press springs (83) and can extend to the slots (40).

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a shock-absorbing circuit board assembly using a contact sensor. Background technique [0002] The installation and removal of the circuit board will affect the operation stability and reliability of the equipment using the circuit board, and will affect its maintainability. The installation of the current circuit board often adopts the method of opening a hole on the circuit board and inserting the circuit board through the fixing column arranged on the equipment rack. Holds the circuit board in place and can be removed for maintenance during use. [0003] However, this installation mode first needs to open a through hole on the circuit board, which will affect the wiring layout of the circuit board itself, and will also affect the stability of the wiring around the through hole. Second, such vias affect the mechanical strength of the board itself. More importantly, this install...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/12
Inventor 邱林新
Owner 邱林新
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