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High-power LED encapsulation structure

A LED packaging, high-power technology, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of high-power LED lamp beads are easy to die, the heat dissipation effect is not very good, dead lights, etc., to achieve low cost and heat dissipation effect Good, the effect of preventing dead lights

Inactive Publication Date: 2016-02-03
广东光宇实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The existing high-power LED lamp bead usually has a high-power LED chip inside, and its heat dissipation effect is not very good. Therefore, this high-power LED lamp bead is easy to die, and once the LED chip dies If it falls off, the entire high-power LED lamp bead will not light up, so there is a risk of dead lights

Method used

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  • High-power LED encapsulation structure

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Embodiment Construction

[0017] refer to Figure 1 to Figure 5 , a high-power LED packaging structure of the present invention, comprising an LED bracket 1, a housing 2 integrally formed on the LED bracket, a transparent cover 3 enclosing the inside of the housing, a bowl 4 is arranged on the LED bracket inside the housing, The bowl is mounted on a uniform temperature plate 5, and a plurality of low-power LED chips 6 are packaged in the bowl. The plurality of low-power LED chips are first connected in series and then in parallel to the positive and negative poles of the LED bracket. The internal structure of the vapor chamber described in the present invention is a well-known and well-known technology at present, and will not be repeated here. The high-power LEDs in the present invention generally refer to LEDs with power above 1W, usually 1-3W, and low-power LEDs generally refer to LEDs with power below 0.5W.

[0018] As a preferred technical solution, the bowl is provided with a plurality of pits 7...

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Abstract

The invention discloses a high-power LED encapsulation structure comprising an LED bracket, a shell integrally formed on the LED bracket, and a transparent cover coating the inside of the shell. A bowl is arranged on the LED bracket inside the shell, and the bowl is surface-mounted on a vapor chamber. Multiple low-power LED chips are encapsulated in the bowl, and the low-power LED chips are connected in series first and then connected in parallel to the positive and negative electrodes of the LED bracket. The bowl is internally provided with multiple pits with a flat bottom, and the multiple low-power LED chips are correspondingly encapsulated in the pits. The pits are circular, square or trapezoidal, and the pits are independent of one another and are arranged at equal intervals. The distance from the bottoms of the pits to the vapor chamber is 0.2mm. Of the 20 low-power LED chips, every five chips are connected in series into a string, and the four strings are connected in parallel to the positive and negative electrodes of the LED bracket. The high-power LED encapsulation structure has a better heat dissipation effect, a high-power LED has a longer service life and is lower in cost, and lamp death is prevented.

Description

technical field [0001] The invention relates to an illuminating device, in particular to a high-power LED package structure. Background technique [0002] The existing high-power LED lamp bead usually has a high-power LED chip inside, and its heat dissipation effect is not very good. Therefore, this high-power LED lamp bead is easy to die, and once the LED chip dies If it falls off, the entire high-power LED lamp bead will not light up, so there is a risk of dead lights. In order to solve this disadvantage, we have made a major breakthrough, combined with the original packaging production technology, and improved the packaging structure of high-power LEDs. Contents of the invention [0003] In order to overcome the deficiencies of the prior art, the purpose of the present invention is to provide a high-power LED packaging structure with better heat dissipation effect, less dead light, and even if a certain LED chip is necrotic, the whole lamp bead is still bright. [000...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/64H01L25/13
CPCH01L33/48H01L25/13H01L33/642
Inventor 王骞
Owner 广东光宇实业有限公司