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Substrate cutting device and method

A technology for cutting devices and substrates, which is applied in glass cutting devices, manufacturing tools, stone processing tools, etc., and can solve problems such as poor surface of substrates, unapplicable range of errors, and small effects

Active Publication Date: 2020-02-14
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the contact cutting process has problems in that surface defects occur due to a physical impact on the substrate, or errors occur and the range of inapplicability is large.
[0006] In addition, in the conventional non-contact cutting process, the expansion and contraction caused by the thermal change of the substrate is used, but there is a problem that the effect is small in materials with a small tensile force due to the thermal change

Method used

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  • Substrate cutting device and method
  • Substrate cutting device and method
  • Substrate cutting device and method

Examples

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Embodiment Construction

[0024] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. First, when reference numerals are attached to components in each drawing, the same components are given the same symbols as much as possible even if they are shown in other drawings. In addition, the preferred embodiments of the present invention will be described below, but the technical idea of ​​the present invention is not limited or limited thereto, and it goes without saying that a person skilled in the art can modify them and implement them in various forms.

[0025] figure 1 and figure 2 It is a figure which shows the case where each thermally-conductive element performs heating or cooling alternately in the board|substrate cutting apparatus which shows the schematic structure of one Example of this invention, respectively.

[0026] said figure 1 and figure 2 In order to understand this invention conceptually and clearly, on...

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Abstract

The present invention relates to an apparatus and method for breaking a substrate. The present invention provides an apparatus for breaking a substrate, which can heat or cool the substrate with a scribing line in the scribing direction to effectively break the substrate and can accurately control the heating or cooling of the substrate to effectively break the substrate. The present invention provides an apparatus for breaking a substrate, comprising: a first heat conduction element for heating or cooling a first area of the substrate with a scribing line; and second heat conduction elements configured to be adjacent to the first heat conduction element in the direction of the scribing line to cool or heat second areas of the substrate inversely with the first area.

Description

technical field [0001] The present invention relates to a substrate cutting device and method, and more particularly, to a substrate cutting device and method capable of cutting a substrate without using a physical method. Background technique [0002] In general, in a brittle material substrate such as a glass substrate, after a scribe line is formed on the substrate along a line to cut in order to cut the substrate, the substrate is cut by a cutting step. [0003] As a method of forming a scribe line on a substrate, there are mechanical processing using a dicing wheel or the like, or a non-contact processing method using irradiation of a laser beam. [0004] After a scribe line is formed on the substrate along the line to be cut, a cutting step is performed in order to completely cut the substrate. Among the substrate cutting methods, there are contact methods that use a roller, a pusher, etc. to affect the substrate, and lasers, steam, etc. A non-contact method of heatin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03B33/033
CPCB28D1/22C03B33/02C03B33/09
Inventor 徐镛植
Owner MITSUBOSHI DIAMOND IND CO LTD