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Film peeling device and film peeling method

A film peeling and thin film technology, applied in the direction of thin material handling, transportation and packaging, sending objects, etc., can solve problems such as inability to peel off

Active Publication Date: 2017-03-08
BEAC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, even with such a film peeling device, there are cases where the film cannot be peeled off from the backing paper.

Method used

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  • Film peeling device and film peeling method
  • Film peeling device and film peeling method
  • Film peeling device and film peeling method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0069] figure 1 It is a front view of the film peeling apparatus 1000 of Embodiment 1. figure 2 It is a plan view of the film peeling apparatus 1000 of Embodiment 1. In addition, in figure 2 , omitting the Figure 1 The delivery mechanism part 910 and the winding mechanism part 920 are shown in . The film in each embodiment described below is a cover film.

[0070] The film peeling device 1000 of Embodiment 1, such as figure 1 and figure 2 As shown, it includes: a base platform 100, which has a cover film Wc (also referred to as a cover film Wc with a backing paper) that is peelably pasted on a backing paper Wm, with a backing paper Wm on its lower side The guide surface 110 supported under the state; can move along the guide surface 110 of the base platform 100 to the front side of the running path of the running path A (arrow x direction) and the running path rear side of the running path A (arrow x' direction) The movable peeling unit 200 that reciprocates withi...

Embodiment approach 2

[0136] Figure 9 It is a front view of the film peeling apparatus 2000 of Embodiment 2.

[0137] Figure 10 It is a plan view of the film peeling apparatus 2000 of Embodiment 2. In addition, in Figure 10 , omitting the Figure 9 The sending mechanism part 910 and the winding mechanism part 920 marked in the middle.

[0138] The difference between the film peeling device 2000 of Embodiment 2 and the film peeling device 1000 of Embodiment 1 is that a pre-peeling mechanism part 660 is provided to separate the front side end (also referred to as the front end) of each cover film slice from The front side end of the cover film slice is pre-peeled by a predetermined amount toward the rear side end. In addition, the pre-separation mechanism part 660 is also called the front-end pre-separation mechanism part 660 because it is a member for pre-separating the front end part of each cover film slice, ie, the front end part. In addition, in the peeling device 2000 of Embodiment 2, ...

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PUM

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Abstract

This film detachment device comprises a pre-detachment mechanism (700) that performs pre-detachment in order to make detachment of a film (Wc) from a base member (Wm) easier. The pre-detachment mechanism (700) performs: a first step in which, while a pre-detachment roll (710) is caused to be in contact with one side end section on the surface of the film (Wc), at least either the film (Wc) or the pre-detachment roll (710) is caused to travel such that the pre-detachment roll (710) rotates, and the film (Wc) is wound to a final winding position while being detached from the base member (Wm); and a second step after the first step, in which at least either the film (Wc) or the pre-detachment roll (710) is caused to travel in the opposite direction, in a state in which the pre-detachment roll (710) is in contact with the surface of the film (Wc), and the film that was wound on to the pre-detachment roll (710) is re-attached to the base member (Wm). As a result of this film detachment device, film can be reliably detached from base paper by using less force than used by conventional film detachment devices.

Description

technical field [0001] The invention relates to a film peeling device for peeling a film from a base material and a film peeling method. Background technique [0002] Usually, a flexible wiring substrate is made by using a thin polyimide film or a polyester film as a base film, and its surface is pasted with copper that constitutes an electronic circuit. foil. In addition, electronic components are directly mounted in an electronic circuit, and the electronic circuit is covered with a film (called a cover film). [0003] In addition, such a flexible wiring board has the characteristics of being thin, soft and freely bendable, but sometimes requires a certain degree of thickness and rigidity when mounting components on it or connecting with a connector. Therefore, in order to ensure rigidity in a part of the base film, a reinforcing plate having a predetermined shape and size is attached to the base film. [0004] In the process of manufacturing the above-mentioned flexibl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65H41/00
CPCB65H41/00B32B43/006B65H29/241B65H29/54B65H2406/334
Inventor 河东和彦羽生慎一
Owner BEAC CO LTD