Thermal column structure

Abstract

The invention discloses a thermal column structure. The thermal column structure comprises a column body, a capillary pipe and a capillary structure arranged in the column body; an upper cover and a baseplate matched with the column body are arranged at the upper and lower ends of the column body, and are tightly matched with the column body; a through hole is formed in the middle part of the upper cover; the lower end of the capillary pipe is welded on the through hole, and the upper end of the capillary pipe is closed, so that the internal of the column body is sealed in vacuum; a proper amount of liquid working medium is filled in the column body sealed in vacuum; the capillary structure comprises an upper capillary structure, a middle capillary structure and a bottom capillary structure arranged along the upper cover, the column body and the inner wall of the baseplate; and the upper capillary structure, the middle capillary structure and the bottom capillary structure are connected to form an integral cooling structure for quickly dissipating heat, so that the cooling effect is further improved, and the service life of the product is largely prolonged.

Description

technical field [0001] The invention relates to heat dissipation technology, in particular to a heat column structure. Background technique [0002] The thermal column absorbs a large amount of heat through the boiling or evaporation of the liquid working medium to generate steam, and the steam condenses on the wall of the thermal column to release a large amount of latent heat of vaporization to realize heat exchange. The heat column is widely used in the fields of LED lamps, electronic components and other heat dissipation. The bottom of the heat column continuously absorbs the heat from the surface of the LED chip or electronic components. Distributed to the external environment or matching heat dissipation equipment through the wall of the condensing tube, thereby effectively controlling the temperature of the LED chip or electronic components, ensuring the stability and reliability of its work. Capillary structures are generally provided on the inner wall of the existi...

AI Technical Summary

Problems solved by technology

Capillary structures are generally provided on the inner wall of the existing heat column, and the capillary force of the capillary structure is used to accelerate the reflux speed of condensed water. However, in the existing heat pipe structure, the capillary structure is generally only provided on the side wall of the heat column, and the efficiency is relatively low.

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