The application relates to the technical field of
semiconductor lighting, in particular to a full-spectrum high-color-rendering
LED lamp bead. The lamp bead comprises an LED support, a
blue light excitation
chip, a
red light enhancement
chip, a multi-component fluorescent
material system, a
silicone encapsulation lens and a
heat management structure. The
blue light excitation
chip and the
red light enhancement chip are die-bonded on the LED support and form electrical connections with the positive and negative
electrode pads respectively; the multi-component fluorescent
material system is formed on the chip surface by adopting a partition
coating process; the
heat management structure comprises a high-thermal-
conductivity ceramic substrate and a silver-plated
copper alloy support frame. The application realizes full-spectrum coverage through the
blue light excitation chip combined with the multi-component fluorescent
material system, and simultaneously configures the
red light enhancement chip to supplement the red light band energy, adopts an optimized partition
coating process and a multi-layer fluorescent structure design, effectively controls the proportion of blue light overflow, and improves the
light conversion efficiency. The lamp bead can significantly improve the general
color rendering index Ra and the special
color rendering index R9, realizes low blue light
hazard, high luminous efficiency and good
thermal stability.