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Low thermal resistance, high light efficiency and high power LED lamp beads

A technology of LED lamp beads and high light efficiency, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve problems such as heat accumulation, achieve the effect of reducing heat accumulation, avoiding excessive heat generation, and maintaining the stability of the frame

Active Publication Date: 2018-01-23
浙江唯唯光电科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] At present, the structure of LED lamp beads is various, generally including chips and brackets. 3V conventional LED lamp beads have become more common, and research on relatively high-voltage LED lamp beads such as 6V, 9V, and 12V has become the current main trend. However, Due to heat accumulation, poor heat conduction and other reasons, multi-chip LED lamp beads have problems in lifespan and light efficiency. Especially the more chips, the more serious the problem. Therefore, simple and efficient solutions to heat accumulation and poor heat conduction have always been the focus of various manufacturers. One of the directions of competing research

Method used

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  • Low thermal resistance, high light efficiency and high power LED lamp beads
  • Low thermal resistance, high light efficiency and high power LED lamp beads
  • Low thermal resistance, high light efficiency and high power LED lamp beads

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Embodiment Construction

[0015] The present invention is described in further detail below:

[0016] The low thermal resistance, high light efficiency and high power LED lamp bead of the present invention includes a 3V chip and a bracket 2. The bracket is a frame with a Japanese-shaped metal frame 2 as the skeleton and coated with PPA plastic 3 on the surface of the skeleton. The metal frame 2 includes the first The letter part 2.1 and the second letter part 2.2, the lower end surface of the first letter part 2.1 and the upper end surface of the second letter part 2.2 are connected, and the cross section of the metal frame 2 is an inverted T shape, such as Figure 4 As shown, the vertical part of the inverted T shape is the first Japanese character part 2.1, the horizontal part of the inverted T shape is the second Japanese character part 2.2, the first mouth of the frame is provided with a first copper sheet 4, and the frame The second mouth is provided with a second copper sheet 5. The first copper ...

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Abstract

The invention provides a low-thermal resistance, high-luminous efficacy and high-power LED lamp bead. The low-thermal resistance, high-luminous efficacy and high-power LED lamp bead has the advantages of little heat accumulation and smooth heat conduction. The low-thermal resistance, high-luminous efficacy and high-power LED lamp bead includes 3V chips and a bracket (2); the bracket (2) is a frame with a theta-shaped metal box (2) adopted as a skeleton, the surface of the theta-shaped metal box (2) being coated with PPA plastic (3); the metal box (2) includes a first theta-shaped part (2.1) and a second theta-shaped part (2.2); the cross section of the metal box (2) is a reverse-T-shaped; the first opening part of the frame is provided with a first copper sheet (4); the second opening part of the frame is provided with a second copper sheet (5); four 3V chips are bonded on the surface of the first copper sheet (4); the four 3V chips are distributed to form a structure shaped like a Chinese character ''tian''; the first copper sheet (4), the first 3V chip (1.1), the second 3V chip (1.2), the third 3V chip (1.3), the fourth 3V chip (1 4) and the second copper sheet (5) are sequentially and electrically connected in series through weld lines (6).

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to a high-power LED lamp bead with low thermal resistance and high light efficiency. Background technique [0002] At present, the structure of LED lamp beads is various, generally including chips and brackets. 3V conventional LED lamp beads have become more common, and research on relatively high-voltage LED lamp beads such as 6V, 9V, and 12V has become the current main trend. However, Due to heat accumulation, poor heat conduction and other reasons, multi-chip LED lamp beads have problems in lifespan and light efficiency. Especially the more chips, the more serious the problem. Therefore, simple and efficient solutions to heat accumulation and poor heat conduction have always been the focus of various manufacturers. One of the directions of competing research. Contents of the invention [0003] The technical problem to be solved by the present invention is to overcome the defects ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/64
CPCH01L33/486H01L33/641H01L33/642
Inventor 蒋明杰黄星
Owner 浙江唯唯光电科技股份有限公司